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Alpha & Omega Semiconductors
Alpha & Omega Semiconductors

AOTF2918L Datasheet Preview

AOTF2918L Datasheet

100V N-Channel MOSFET

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AOTF2918L pdf
AOT2918L/AOB2918L/AOTF2918L
100V N-Channel MOSFET
General Description
Product Summary
The AOT2918L & AOB2918L & AOTF2918L uses Trench
MOSFET technology that is uniquely optimized to provide
the most efficient high frequency switching performance.
Power losses are minimized due to an extremely low
combination of RDS(ON) and Crss.
In addition, switching behavior is well controlled with a
soft recovery body diode.This device is ideal for boost
converters and synchronous rectifiers for consumer,
telecom, industrial power supplies and LED backlighting.
VDS
ID (at VGS=10V)
RDS(ON) (at VGS=10V)
100% UIS Tested
100% Rg Tested
100V
90A
< 7m
TO-220
TO-220F
Top View
TO-263
D2PAK
D
D
AOT2918L
DS
G AOTF2918L
S
GD
G
AOB2918L
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol AOT2918L/AOB2918L
AOTF2918L
Drain-Source Voltage
VDS
100
Gate-Source Voltage
VGS
±20
Continuous Drain TC=25°C
Current G
TC=100°C
Pulsed Drain Current C
ID
IDM
90
70
260
58
45
Continuous Drain
TA=25°C
Current
TA=70°C
Avalanche Current C
Avalanche energy L=0.1mH C
IDSM
IAS, IAR
EAS, EAR
13
10
35
61
TC=25°C
Power Dissipation B TC=100°C
PD
267
133
41
20
TA=25°C
Power Dissipation A TA=70°C
PDSM
2.1
1.33
Junction and Storage Temperature Range
TJ, TSTG
-55 to 175
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Case
t 10s
Steady-State
Steady-State
Symbol
RθJA
RθJC
AOT2918L/AOB2918L
15
60
0.56
AOTF2918L
15
60
3.6
G
S
Units
V
V
A
A
A
mJ
W
W
°C
Units
°C/W
°C/W
°C/W
Rev 2 : Feb 2011
www.aosmd.com
Page 1 of 7
Free Datasheet http://www.datasheet4u.com/



Alpha & Omega Semiconductors
Alpha & Omega Semiconductors

AOTF2918L Datasheet Preview

AOTF2918L Datasheet

100V N-Channel MOSFET

No Preview Available !

AOTF2918L pdf
AOT2918L/AOB2918L/AOTF2918L
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min Typ Max Units
STATIC PARAMETERS
BVDSS Drain-Source Breakdown Voltage
IDSS Zero Gate Voltage Drain Current
ID=250µA, VGS=0V
VDS=100V, VGS=0V
IGSS
VGS(th)
ID(ON)
RDS(ON)
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
Static Drain-Source On-Resistance
VDS=0V, VGS= ±20V
VDS=VGSID=250µA
VGS=10V, VDS=5V
VGS=10V, ID=20A
gFS Forward Transconductance
VDS=5V, ID=20A
VSD Diode Forward Voltage
IS=1A,VGS=0V
IS Maximum Body-Diode Continuous CurrentG
TJ=55°C
TJ=125°C
100
2.7
260
3.3
5.6
9
34
0.7
V
1
µA
5
100 nA
3.9 V
A
7
m
12
S
1V
90 A
DYNAMIC PARAMETERS
Ciss Input Capacitance
Coss Output Capacitance
Crss Reverse Transfer Capacitance
Rg Gate resistance
VGS=0V, VDS=50V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
2580
1530
37
1.5
3430
2035
63
2.3
pF
pF
pF
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
38 53 nC
Qgs Gate Source Charge
VGS=10V, VDS=50V, ID=20A
12 nC
Qgd Gate Drain Charge
12 nC
tD(on)
Turn-On DelayTime
17 38 ns
tr Turn-On Rise Time
VGS=10V, VDS=50V, RL=2.5,
24 53 ns
tD(off)
Turn-Off DelayTime
RGEN=3
30 66 ns
tf Turn-Off Fall Time
24 53 ns
trr Body Diode Reverse Recovery Time IF=20A, dI/dt=500A/µs
46 65 ns
Qrr Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/µs
230 320 nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application
depends on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep
initial TJ =25°C.
D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink,
assuming a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse rating.
G. The maximum current limited by package is 120A.
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev2 : Feb 2011
www.aosmd.com
Page 2 of 7
Free Datasheet http://www.datasheet4u.com/


Part Number AOTF2918L
Description 100V N-Channel MOSFET
Maker Alpha & Omega Semiconductors
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