Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 5)
Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V
Operating Temperature Range...... -40°C < TJ < 125°C
Storage Temperature.......................... -65°C to +150°C
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1174 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Input Operating Voltage
Maximum Output Current
VOUT Temperature Coefficient
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
V Note 6
ppm/°C Note 1
% (VR + 1V) ≤ VIN ≤ 6V
% IL = 0.1mA to IOUTMAX (Note 2)
mV IL = 0.1mA
IL = 100mA
IL = 300mA (Note 3)
µA SHDN = VIH
µA SHDN = 0V
FRE – 1kHz
VOUT = 0V
nV/√Hz F = 10kHz, IL = IOUTMAX
470pF from Bypass to GND
SHDN Input High Threshold
SHDN Input Low Threshold
45 — — %VIN
— — 15 %VIN
Adjustable Input Leakage Current
1: TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x ∆T
2: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
3: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
4: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
5: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
6: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX.
© 2002 Microchip Technology Inc.