http://www.datasheet4u.com

900,000+ Datasheet PDF Search and Download

Datasheet4U offers most rated semiconductors datasheets pdf





Micron
Micron

MT29F32G08RAAC3 Datasheet Preview

MT29F32G08RAAC3 Datasheet

NAND Flash Memory

No Preview Available !

MT29F32G08RAAC3 pdf
Micron Confidential and Proprietary
16, 32, 64, 128Gb NAND Flash Memory
Features
NAND Flash Memory
MT29F16G08MAAWP, MT29F32G08QAAWP, MT29F64G08TAAWP,
MT29F16G08MAAC3, MT29F32G08RAAC3, MT29F64G08UAAC4,
MT29F32G08RAAC6, MT29F64G08UAAC6, MT29F128G08WAAC6
Features
• Open NAND Flash Interface (ONFI) 1.0 compliant
• Multilevel cell (MLC) technology
• Organization
Page size: x8: 4,314 bytes (4,096 + 218 bytes)
Block size:128 pages (512K + 27K bytes)
Plane size: 2,048 blocks
Device size: 16Gb: 4,096 blocks; 32Gb: 8,192
blocks; 64Gb: 16,384 blocks; 128Gb: 32,768 blocks
• READ performance
Random READ: 50µs
Sequential READ: 25ns
• WRITE performance
PROGRAM PAGE: 900µs (TYP)
BLOCK ERASE: 3.5ms (TYP)
• Endurance
10,000 PROGRAM/ERASE cycles (8-bit ECC1)
• Data retention: 10 years
• First block (block address 00h) guaranteed to be
valid when shipped from factory1
• Industry-standard basic NAND Flash command set
• Advanced command set
PROGRAM PAGE CACHE MODE
PAGE READ CACHE MODE
One-time programmable (OTP) commands
Two-plane commands
Interleaved die operations
READ UNIQUE ID (contact factory)
• Operation status byte provides a software method of
detecting:
Operation completion
Pass/fail condition
Write-protect status
• Ready/busy# (R/B#) signal provides a hardware
method of detecting PROGRAM or ERASE cycle
completion
• WP# signal: entire device hardware write protect
• RESET required after power-up
• INTERNAL DATA MOVE operations supported
within the plane from which data is read
Figure 1: 48-Pin TSOP Type 1
Options
• Density
• Device width: x8www.DataSheet.net/
• Configuration:
Package # of die # of CE# # of R/B# I/O
TSOP/LGA 1
1
1 Common
TSOP
2
2
2 Common
TSOP
4
2
2 Common
LGA 2
2
2 Separate
LGA 4
2
2 Separate
LGA 8
4
4 Separate
• VCC: 2.7–3.6V
• Package: 48 TSOP type I (lead-free plating)
52-pad ULGA
52-pad VLGA
52-pad LLGA
• Operating temperature:
• Commercial temperature (0°C to 70°C)
Extended temperature (–40°C to +85°C)
Notes: 1. For details, see “Error Management” on
page 88.
2. For part numbering and markings, see
Figure 2 on page 2.
PDF: 09005aef8278ee3f / Source: 09005aef81f17540
16gb_nand_mlc_l52a__1.fm -Rev. D 5/08 EN
1 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2005 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
Datasheet pdf - http://www.DataSheet4U.co.kr/



Micron
Micron

MT29F32G08RAAC3 Datasheet Preview

MT29F32G08RAAC3 Datasheet

NAND Flash Memory

No Preview Available !

MT29F32G08RAAC3 pdf
Micron Confidential and Proprietary
16, 32, 64, 128Gb NAND Flash Memory
Part Numbering Information
Part Numbering Information
Micron NAND Flash devices are available in several different configurations and densi-
ties (see Figure 2).
Figure 2: Part Number Chart
MT 29F 16G 08 M A A WP
Micron Technology
Product Family
29F = Single-supply NAND Flash memory
Density
16G = 16Gb
32G = 32Gb
64G = 64Gb
128G = 128Gb
Device Width
08 = 8 bits
Classification
# of die # of CE# # of R/B#
I/O
M 1 1 1 Common
Q 2 2 2 Common
T 4 2 2 Common
R 2 2 2 Separate
U 4 2 2 Separate
W 8 4 4 Separate
www.DataSheet.net/
Operating Voltage Range
A = 3.3V (2.7–3.6V)
ES :A
Design Revision
A = First revision
Production Status
Blank = Production
ES = Engineering sample
MS = Mechanical sample
QS = Qualification sample
Operating Temperature Range
Blank = Commercial (0°C to +70°C)
ET = Extended (–40°C to +85°C)
Reserved for Future Use
Blank
NAND Flash Performance
Blank = Standard
Package Code
WP = 48-pin TSOP I (lead-free)
C3 = 52-pad ULGA
C4 = 52-pad VLGA
C6 = 52-pad LLGA
Feature Set
A = Feature set A
Valid Part Number Combinations
After building the part number from the part numbering chart, verify that the part
number is offered and valid by using the Micron Parametric Part Search Web site at
www.micron.com/products/parametric. If the device required is not on this list, contact
the factory.
PDF: 09005aef8278ee3f / Source: 09005aef81f17540
16gb_nand_mlc_l52a__1.fm -Rev. D 5/08 EN
2 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2005 Micron Technology, Inc. All rights reserved.
Datasheet pdf - http://www.DataSheet4U.co.kr/


Part Number MT29F32G08RAAC3
Description NAND Flash Memory
Maker Micron
Total Page 30 Pages
PDF Download
MT29F32G08RAAC3 pdf
Download PDF File
MT29F32G08RAAC3 pdf
View for Mobile






Related Datasheet

1 MT29F32G08RAAC3 NAND Flash Memory Micron
Micron
MT29F32G08RAAC3 pdf
2 MT29F32G08RAAC6 NAND Flash Memory Micron
Micron
MT29F32G08RAAC6 pdf




Part Number Start With

0    1    2    3    4    5    6    7    8    9    A    B    C    D    E    F    G    H    I    J    K    L    M    N    O    P    Q    R    S    T    U    V    W    X    Y    Z

site map

webmaste! click here

contact us

Buy Components