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MT29F64G08CECCB Datasheet Preview

MT29F64G08CECCB Datasheet

NAND Flash Memory

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MT29F64G08CECCB pdf
Micron Confidential and Proprietary
Advance
32Gb, 64Gb, 128Gb Asynchronous/Synchronous NAND
Features
NAND Flash Memory
MT29F32G08CBACA, MT29F64G08CEACA, MT29F64G08CFACA,
MT29F128G08CXACA, MT29F64G08CECCB
Features
Open NAND Flash Interface (ONFI) 2.2-compliant1
Multiple-level cell (MLC) technology
Organization
Page size x8: 4320 bytes (4096 + 224 bytes)
Block size: 256 pages (1024K + 56K bytes)
Plane size: 2 planes x 2048 blocks per plane
Device size: 32Gb: 4096 blocks;
64Gb: 8192 blocks;
128Gb: 16,384 blocks
Synchronous I/O performance
Up to synchronous timing mode 5
Clock rate: 10ns (DDR)
Read/write throughput per pin: 200 MT/s
Asynchronous I/O performance
Up to asynchronous timing mode 5
tRC/tWC: 20ns (MIN)
Array performance
Read page: 50µs (MAX)
Program page: 1300µs (TYP)
Erase block: 3ms (TYP)
Operating Voltage Range
VCC: 2.7–3.6V
VCCQ: 1.7–1.95V, 2.7–3.6V
Command set: ONFI NAND Flash Protocol
Advanced Command Set
Program cache
Read cache sequential
Read cache random
One-time programmable (OTP) mode
Multi-plane commands
Multi-LUN operations
Read unique ID
Copyback
First block (block address 00h) is valid when ship-
ped from factory. For minimum required ECC, see
Error Management (page 101).
RESET (FFh) required as first command after power-
on
Operation status byte provides software method for
detecting
Operation completion
Pass/fail condition
Write-protect status
Data strobe (DQS) signals provide a hardware meth-
od for synchronizing data DQ in the synchronous
interface
Copyback operations supported within the plane
from which data is read
Quality and reliability
Data retention: 10 years
Endurance: 3000 PROGRAM/ERASE cycles
Operating temperature:
Commercial: 0°C to +70°C
Industrial (IT): –40ºC to +85ºC
Package
52-pad LGA
48-pin TSOP
100-ball BGA
Note: 1. The ONFI 2.2 specification is available at
www.onfi.org.
PDF: 09005aef83f64350
l73a_32g_64g_128g_asyncsync_nand.pdf – Rev. A 3/10 EN
1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Micron without notice. Products are only warranted by Micron to meet Micron's production data sheet specifications.
Free Datasheet http://www.Datasheet4U.com



Micron
Micron

MT29F64G08CECCB Datasheet Preview

MT29F64G08CECCB Datasheet

NAND Flash Memory

No Preview Available !

MT29F64G08CECCB pdf
Micron Confidential and Proprietary
Advance
32Gb, 64Gb, 128Gb Asynchronous/Synchronous NAND
Features
Part Numbering Information
Micron NAND Flash devices are available in different configurations and densities. Verify valid part numbers by
using Micron’s part catalog search at www.micron.com. To compare features and specifications by device type,
visit www.micron.com/products. Contact the factory for devices not found.
Figure 1: Part Numbering
MT 29F 32G 08 C B A C A WP
Micron Technology
NAND Flash
29F = NAND Flash memory
Density
32G = 32Gb
64G = 64Gb
128G = 128Gb
Device Width
08 = 8 bits
Level
Bit/Cell
C 2-bit
Classification
Die # of CE# # of R/B# I/O
B1
1
1 Common
E2
2
2 Separate
F2
2
2 Common
X4
4
2 Separate
Operating Voltage Range
A
C
=
=
VVCCCC::
3.3V
3.3V
(2.7–3.6V),
(2.7–3.6V),
VVCCCCQQ::
3.3V
1.8V
(2.7–3.6V)
(1.7–1.95V)
Note: 1. Pb-free package.
ES :C
Design Revision
C = Third revision
Production Status
Blank = Production
ES = Engineering sample
Reserved for Future Use
Blank
Operating Temperature Range
Blank = Commercial (0°C to +70°C)
IT = Industrial (–40°C to +85°C)
Speed Grade (synchronous mode only)
10 = 200 MT/s
Package Code
D1 = 52-pad VLGA 11mm x 14mm x 0.9mm1
H1 = 100-ball VBGA 12mm x 18mm x 1.0mm1
WP = 48-pin TSOP1 (CPL)
Interface
A = Async only
B = Sync/Async
Generation Feature Set
C = Third set of device features
PDF: 09005aef83f64350
l73a_32g_64g_128g_asyncsync_nand.pdf – Rev. A 3/10 EN
2 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.
Free Datasheet http://www.Datasheet4U.com


Part Number MT29F64G08CECCB
Description NAND Flash Memory
Maker Micron
Total Page 30 Pages
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