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Micron Technology
Micron Technology

MT28C128532W30D Datasheet Preview

MT28C128532W30D Datasheet

(MT28C128532W18 / MT28C128564W18) 128Mb Multibank Burst Flash 32Mb ASYNC/PAGE CellularRAM COMBO Memory

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MT28C128532W30D pdf
ADVANCE
128Mb MULTIBANK BURST FLASH
32Mb/64Mb ASYNC/PAGE CellularRAM COMBO
FLASH AND CellularRAM
COMBO MEMORY
MT28C128532W18/W30D
MT28C128564W18/W30D
Low Voltage, Wireless Temperature
Features
• Stacked die Combo package
Includes two 64Mb Flash devices
Choice of either one 32Mb or one 64Mb
www.DataSheet4U.cCoemllularRAMÔ device
• Basic configuration
Flash
Flexible multibank architecture
4 Meg x 16 Async/Page/Burst interface
Support for true concurrent operations with
no latency
CellularRAM
Low-power, high-density design
2 Meg x 16 or 4 Meg x 16 configurations
Async/Page
• F_VCC, VCCQ, F_VPP, PS_VCC voltages
1.70V (MIN)/1.95V (MAX) F_VCC, PS_VCC
1.70V (MIN)/2.24V (MAX) VCCQ (W18)
1.70V (MIN)/3.3V(MAX) VCCQ (W30)
1.80V (TYP) F_VPP (in-system PROGRAM/ERASE)
12V ±5% (HV) F_VPP (in-house programming and
accelerated programming algorithm [APA]
activation)
• Asynchronous access time
Flash/CellularRAM access time: 60ns @ 1.70V VCC
• Page Mode read access (W18/W30)
Interpage read access: 60ns @ 1.70V F_VCC , PS_VCC (W18)
Intrapage read access: 20ns @ 1.70V F_VCC, PS_VCC (W18)
Interpage read access: 70ns @ 1.70V F_VCC , PS_VCC (W30)
Intrapage read access: 22ns @ 1.70V F_VCC, PS_VCC (W30)
• Enhanced suspend options
ERASE-SUSPEND-to-READ within same bank
PROGRAM-SUSPEND-to-READ within same bank
ERASE-SUSPEND-to-PROGRAM within same bank
• Read/Write CellularRAM during program/erase of
Flash
• Each Flash contains two 64-bit chip protection
registers for security purposes
• Flash PROGRAM/ERASE cycles
100,000 WRITE/ERASE cycles per block
• Cross-compatible command set support
Extended command set
Common Flash interface (CFI) compliant
• Manufacturer’s ID (ManID)
Micron® (0x2Ch)
Intel® (0x89h)
Figure 1: 77-Ball FBGA
1
A A4
234567
A18 A19 PS_VSS F_VCC F_VCC A21
8
A11
B A5 PS_LB#
PS_VSS NC CLK NC A12
C A3
A17
F_VPP PS_WE# PS_CE# A9
A13
D A2
A7
F_WP# ADV# A20 A10 A15
E A1
A6 PS_UB# F_RST# F_WE# A8
A14 A16
F A0 DQ8 DQ2 DQ10 DQ5 DQ13 WAIT# F_CE2#
G PS_OE# DQ0 DQ1 DQ3 DQ12 DQ14 DQ7 F_OE2#
H NC F_OE1# DQ9 DQ11 DQ4 DQ6 DQ15 VCCQ
J F_CE1# NC NC NC PS_VCC F_VCC VCCQ PS_ZZ#
K PS_VSS VSSQ VCCQ F_VCC PS_VSS VSSQ F_VSS PS_VSS
Top View
(Ball Down)
Options
• Timing
60ns
70ns
• Burst Frequency
66 MHz1
54 MHz
• Boot Block Configuration
Top/Top
Top/Bottom
Bottom/Top
Bottom/Bottom
• I/O Voltage Range
VccQ 1.70V–1.95V
VccQ 1.70V–3.3V
• Manufacturer’s ID (ManID)
Micron (0x2Ch)
Intel (0x89h)
• Operating Temperature Range
Wireless Temperature (-25°C to +85°C)
• Package
77-ball FBGA (8 x 10 grid)
Marking
-60
-70
6
5
TT
TB
BT
BB
18
30
None
K
WT
FW
NOTE: 1. Contact factory for availability.
Part Number Example:
MT28C128564W18DFW-705 BBWT
09005aef80b10a55
MT28C128564W18D_B.fm - Rev. B, Pub 7/03 EN
1
©2003 Micron Technology, Inc.
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE SUBJECT TO CHANGE BY
MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S PRODUCTION DATA SHEET SPECIFICATIONS.



Micron Technology
Micron Technology

MT28C128532W30D Datasheet Preview

MT28C128532W30D Datasheet

(MT28C128532W18 / MT28C128564W18) 128Mb Multibank Burst Flash 32Mb ASYNC/PAGE CellularRAM COMBO Memory

No Preview Available !

MT28C128532W30D pdf
ADVANCE
128Mb MULTIBANK BURST FLASH
32Mb/64Mb ASYNC/PAGE CellularRAM COMBO
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Flash Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Device Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Part Numbering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Boot Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
MultiChip Packaging Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Unique IDs, State Machines, and Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Command Codes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
www.DataSheReEt4AUD.coOmperation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Flash Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Power Consumption. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Flash Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Data Sheet Designation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
09005aef80b10a55
MT28C128564W18D_B.fm - Rev. B, Pub 7/03 EN
2 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology. Inc.


Part Number MT28C128532W30D
Description (MT28C128532W18 / MT28C128564W18) 128Mb Multibank Burst Flash 32Mb ASYNC/PAGE CellularRAM COMBO Memory
Maker Micron Technology
Total Page 21 Pages
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