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Micron Technology
Micron Technology

MT29C1G12MADRACG-6IT Datasheet Preview

MT29C1G12MADRACG-6IT Datasheet

NAND Flash and Mobile LPDRAM

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MT29C1G12MADRACG-6IT pdf
Preliminary
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Features
NAND Flash and Mobile LPDRAM
152-Ball Package-on-Package (PoP)
Combination Memory (TI OMAP™)
MT29C Family
Current production part numbers: See Table 1 on page 3
Features
• Micron® NAND Flash and Mobile LPDRAM
components
• RoHS-compliant, “green” package
• Separate NAND Flash and Mobile LPDRAM
interfaces
• Space-saving package-on-package combination
• Low-voltage operation (1.70–1.95V)
• Industrial temperature range: –40°C to +85°C
NAND Flash-Specific Features
• Organization
Page size
x8: 2112 bytes (2048 + 64 bytes)
x16: 1056 words (1024 + 32 words)
Block size: 64 pages (128K + 4K bytes)
Mobile LPDRAM-Specific Features
• No external voltage reference required
• No minimum clock rate requirement
• 1.8V LVCMOS-compatible inputs
• Programmable burst lengths
• Partial-array self refresh (PASR)
• Deep power-down (DPD) mode
• Selectable output drive strength
• STATUS REGISTER READ (SRR) supported1
Figure 1: PoP Block Diagram
NAND Flash
Power
NAND Flash
Device
NAND Flash
Interface
LP-DRAM Power
www.DataSheet.net/
LP-DRAM
Device
LP-DRAM Interface
Options
• LP-DRAM
166 MHz CL32
133 MHz CL3
Marking
-6
-75
Notes: 1. Contact factory for remapped SRR output.
2. CL = CAS (READ) latency.
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
1 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.
Datasheet pdf - http://www.DataSheet4U.co.kr/



Micron Technology
Micron Technology

MT29C1G12MADRACG-6IT Datasheet Preview

MT29C1G12MADRACG-6IT Datasheet

NAND Flash and Mobile LPDRAM

No Preview Available !

MT29C1G12MADRACG-6IT pdf
Preliminary
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Part Numbering Information – 152-Ball PoP
Part Numbering Information – 152-Ball PoP
Micron NAND Flash and LPDRAM devices are available in different configurations and
densities.
Figure 2: 152-Ball Part Number Chart
Micron Technology
Product Family
29C = NAND + LPDRAM MCP
NAND Density
1G = 1Gb
2G = 2Gb
4G = 4Gb
LPDRAM Density
12M = 512Mb
24M = 1024Mb
48M = 2048Mb
Operating Voltage Range
A = 1.8V (1.70–1.95V)
NAND Flash Configuration
Width Density Generation
C x8
1Gb First
D x16 1Gb First
J x8
2Gb Second
K x16 2Gb Second
N x8
4Gb First
P x16 4Gb First
U x8
1Gb Second
V x16 1Gb Second
MT 29C 1G 24M A C J A CG – x
www.DataSheet.net/
LPDRAM Configuration
Type Width Density Generation
J DDR x16 1Gb First
L DDR x32 1Gb First
N DDR x16 512Mb Second
R DDR x32 512Mb Second
IT ES
Production Status
Blank = Production
ES = Engineering sample
MS = Mechanical sample
Operating Temperature Range
IT = Industrial (–40° to +85°C)
LPDRAM Self Refresh Current
Blank = Standard
LPDRAM Access Time
–6 166 MHz CL3
–75 133 MHz CL3
Package Codes
CA = 152-ball PoP VFBGA (14 x 14 x 0.9mm)
CG = 152-ball PoP VFBGA (14 x 14 x 1.0mm)
JQ = 152-ball PoP TFBGA (14 x 14 x 1.1mm)
Chip Count
CE#, CS# Chip Count
A 1, 1 1 NAND, 1 DRAM
B 1, 1 2 NAND, 1 DRAM
C 1, 2 1 NAND, 2 DRAM
D 1, 2 2 NAND, 2 DRAM
Note: Not all possible combinations are available. Contact factory for availability.
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
2 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Datasheet pdf - http://www.DataSheet4U.co.kr/


Part Number MT29C1G12MADRACG-6IT
Description NAND Flash and Mobile LPDRAM
Maker Micron Technology
Total Page 15 Pages
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MT29C1G12MADRACG-6IT pdf
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