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  Microsemi Electronic Components Datasheet  

APT10DC120HJ Datasheet

SiC Diode Full Bridge Power Module

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APT10DC120HJ pdf
APT10DC120HJ
ISOTOP® SiC Diode
Full Bridge Power Module
+~
~-
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ISOTOP®
VRRM = 1200V
IC = 10A @ Tc = 100°C
Application
Switch mode power supplies rectifier
Induction heating
Welding equipment
High speed rectifiers
Features
SiC Schottky Diode
- Zero reverse recovery
- Zero forward recovery
- Temperature Independent switching behavior
- Positive temperature coefficient on VF
ISOTOP® Package (SOT-227)
Very low stray inductance
High level of integration
Benefits
Outstanding performance at high frequency operation
Low losses
Low noise switching
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
RoHS Compliant
Absolute maximum ratings
Symbol
Parameter
VR Maximum DC reverse Voltage
VRRM Maximum Peak Repetitive Reverse Voltage
IF(AV) Maximum Average Forward Current Duty cycle = 50%
IFSM Non-Repetitive Forward Surge Current
10 µs
TC = 100°C
TC = 25°C
Max ratings
1200
10
250
Unit
V
A
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
See application note APT0502 on www.microsemi.com
www.microsemi.com
1-3


  Microsemi Electronic Components Datasheet  

APT10DC120HJ Datasheet

SiC Diode Full Bridge Power Module

No Preview Available !

APT10DC120HJ pdf
APT10DC120HJ
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic
VF Diode Forward Voltage
IRM Maximum Reverse Leakage Current
QC Total Capacitive Charge
C Total Capacitance
Test Conditions
Min Typ Max Unit
IF = 10A
VR = 1200V
Tj = 25°C
Tj = 175°C
Tj = 25°C
Tj = 175°C
1.6 1.8
2.3 3
V
32 200 µA
56 1000
IF = 10A, VR = 600V
di/dt =500A/µs
40 nC
f = 1MHz, VR = 200V
f = 1MHz, VR = 400V
96 pF
69
Thermal and package characteristics
Symbol Characteristic
RthJC
RthJA
VISOL
TJ,TSTG
TL
Torque
Wt
Junction to Case Thermal resistance
Junction to Ambient
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Storage Temperature Range
Max Lead Temp for Soldering:0.063” from case for 10 sec
Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine)
Package Weight
Min Typ
2500
-55
29.2
Max Unit
1.65 °C/W
20
V
175
300
°C
1.5 N.m
g
SOT-227 (ISOTOP®) Package Outline
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31.5 (1.240)
31.7 (1.248)
7.8 (.307)
8.2 (.322)
r = 4.0 (.157)
(2 places)
W=4.1 (.161)
W=4.3 (.169)
H=4.8 (.187)
H=4.9 (.193)
(4 places)
4.0 (.157)
4.2 (.165)
(2 places)
11.8 (.463)
12.2 (.480)
8.9 (.350)
9.6 (.378)
Hex Nut M4
(4 places)
0.75 (.030)
0.85 (.033)
25.2 (0.992)
25.4 (1.000)
3.30 (.130) 12.6 (.496)
4.57 (.180) 12.8 (.504)
14.9 (.587)
15.1 (.594)
30.1 (1.185)
30.3 (1.193)
38.0 (1.496)
38.2 (1.504)
3.3 (.129)
3.6 (.143)
1.95 (.077)
2.14 (.084)
Dimensions in Millimeters and (Inches)
www.microsemi.com
2-3


Part Number APT10DC120HJ
Description SiC Diode Full Bridge Power Module
Maker Microsemi
Total Page 3 Pages
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