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P3S56D40ETP Datasheet Preview

P3S56D40ETP Datasheet

256M Double Data Rate Synchronous DRAM

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P3S56D40ETP pdf
DDR SDRAM (Rev.1.2)
Jun. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40ATP
256M Double Data Rate Synchronous DRAM
PRELIMINARY
Some of contents are subject to change without notice.
DESCRIPTION
M2S56D20ATP is a 4-bank x 16,777,216-word x 4-bit,
M2S56D30ATP is a 4-bank x 8,388,608-word x 8-bit,
M2S56D40ATP is a 4-bank x 4,194,304-word x 16-bit,
double data rate synchronous DRAM, with SSTL_2 interface. All control and address signals are
referenced to the rising edge of CLK. Input data is registered on both edges of data strobe, and output
data and data strobe are referenced on both edges of CLK. The M2S56D20/30/40ATP achieves very
high speed data rate up to 133MHz, and are suitable for main memory in computer systems.
FEATURES
- Vdd=Vddq=2.5V+0.2V
- Double data rate architecture;
two data transfers per clock cycle
- Bidirectional, data strobe (DQS) is transmitted/received with data
- Differential clock inputs (CLK and /CLK)
- DLL aligns DQ and DQS transitions
with CLK transitions edges of DQS
- Commands entered on each positive CLK edge;
- data and data mask referenced to both edges of DQS
- 4 bank operation controlled by BA0, BA1 (Bank Address)
- /CAS latency- 2.0/2.5 (programmable)
- Burst length- 2/4/8 (programmable)
- Burst type- sequential / interleave (programmable)
- Auto precharge / All bank precharge controlled by A10
- 8192 refresh cycles /64ms (4 banks concurrent refresh)
- Auto refresh and Self refresh
- Row address A0-12 / Column address A0-9,11(x4)/ A0-9(x8)/ A0-8(x16)
- SSTL_2 Interface
- 400-mil, 66-pin Thin Small Outline Package (TSOP II)
- JEDEC standard
Operating Frequencies
Speed
Grade
-75A
-75
-10
Clock Rate
CL=2 *
133MHz
CL=2.5 *
133MHz
100MHz 133MHz
100MHz 125MHz
* CL = CAS(Read) Latency
MITSUBISHI ELECTRIC
1



Mitsubishi
Mitsubishi

P3S56D40ETP Datasheet Preview

P3S56D40ETP Datasheet

256M Double Data Rate Synchronous DRAM

No Preview Available !

P3S56D40ETP pdf
DDR SDRAM (Rev.1.2)
Jun. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40ATP
256M Double Data Rate Synchronous DRAM
VDD
NC
VDDQ
NC
DQ0
VSSQ
NC
NC
VDDQ
NC
DQ1
VSSQ
NC
NC
VDDQ
NC
NC
VDD
NC
NC
/WE
/CAS
/RAS
/CS
NC
BA0
BA1
A10/AP
A0
A1
A2
A3
VDD
VDD
DQ0
VDDQ
NC
DQ1
VSSQ
NC
DQ2
VDDQ
NC
DQ3
VSSQ
NC
NC
VDDQ
NC
NC
VDD
NC
NC
/WE
/CAS
/RAS
/CS
NC
BA0
BA1
A10/AP
A0
A1
A2
A3
VDD
PIN CONFIGURATION(TOP VIEW)
x4
x8
x16
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VSSQ
DQ7
NC
VDDQ
LDQS
NC
VDD
NC
LDM
/WE
/CAS
/RAS
/CS
NC
BA0
BA1
A10/AP
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
66pin TSOP(II)
400mil width
x
875mil length
0.65mm
Lead Pitch
ROW
A0-12
Column
A0-9,11(x4)
A0-9 (x8)
A0-8 (x16)
66 VSS
65 DQ15
64 VSSQ
63 DQ14
62 DQ13
61 VDDQ
60 DQ12
59 DQ11
58 VSSQ
57 DQ10
56 DQ9
55 VDDQ
54 DQ8
53 NC
52 VSSQ
51 UDQS
50 NC
49 VREF
48 VSS
47 UDM
46 /CLK
45 CLK
44 CKE
43 NC
42 A12
41 A11
40 A9
39 A8
38 A7
37 A6
36 A5
35 A4
34 VSS
VSS
DQ7
VSSQ
NC
DQ6
VDDQ
NC
DQ5
VSSQ
NC
DQ4
VDDQ
NC
NC
VSSQ
DQS
NC
VREF
VSS
DM
/CLK
CLK
CKE
NC
A12
A11
A9
A8
A7
A6
A5
A4
VSS
VSS
NC
VSSQ
NC
DQ3
VDDQ
NC
NC
VSSQ
NC
DQ2
VDDQ
NC
NC
VSSQ
DQS
NC
VREF
VSS
DM
/CLK
CLK
CKE
NC
A12
A11
A9
A8
A7
A6
A5
A4
VSS
CLK,/CLK
CKE
/CS
/RAS
/CAS
/WE
DQ0-7
DQS
DM
Vref
: Master Clock
: Clock Enable
: Chip Select
: Row Address Strobe
: Column Address Strobe
: Write Enable
: Data I/O
: Data Strobe
: Write Mask
: Reference Voltage
A0-12
BA0,1
Vdd
VddQ
Vss
VssQ
: Address Input
: Bank Address Input
: Power Supply
: Power Supply for Output
: Ground
: Ground for Output
MITSUBISHI ELECTRIC
2


Part Number P3S56D40ETP
Description 256M Double Data Rate Synchronous DRAM
Maker Mitsubishi
Total Page 30 Pages
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