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NSHC221J50TRA1F Datasheet Preview

NSHC221J50TRA1F Datasheet

Stacked Film Capacitor Chips

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NSHC221J50TRA1F pdf
Stacked Film Capacitor Chips
NSHC Series
FEATURES
• STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM
• STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES
• WIDE TEMPERATURE RANGE UP TO +125OC (100pF ~ 0.1μF)
• HIGH HEAT AND MOISTURE RESISTANT
• VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS
CHARACTERISTICS
• SUITABLE FOR REFLOW SOLDERING
• TAPE AND REEL PACKAGING
NSHC IS
RECOMMENDED
FOR NEW DESIGNS
RoHS
Compliant
includes all homogeneous materials
*See Part Number System for Details
SPECIFICATIONS
Capacitance Range
Voltage Ratings
Capacitance Tolerance
Temperature Range
Dissipation Factor (20°C)
Insulation Resistance (20°C)
Dielectric Withstanding Voltage
Temperature Characteristic
Case Sizes
0603
0805
1206
1210
1913
2416
100pF ~ 0.0027μF 100pF ~ .01μF 3300pF ~ .047μF .012μF ~ .1μF .047μF ~ .1μF .12μF ~ .22μF
16Vdc (12Vrms), 50Vdc (40Vrms)
±5% Std, ±2% Opt.
-55°C ~ +125°C (0.12μF ~ 0.22μF voltage derated above +105°C)
0.6% max. @ 1KHz
3 Gigohms Minimum
150% of Rated Voltage 60 Seconds or
175% of Rated Voltage for 5 Seconds (except 1913 and 2416 case sizes)
±3% ΔC Maximum Over Temperature Range
ENVIRONMENTAL CHARACTERISTICS
Life Test At +125°C
Capacitance Change
Within ±2% of Initial Value
1,000 Hours at 125% of
Dissipation Factor
0.68% Maximum
Rated Voltage
Insulation Resistance
1 Gigohm Minimum
Resistance to Soldering Heat
+260°C Peak
Capacitance Change
Dissipation Factor
Insulation Resistance
Within ±3% of Initial Value
0.66% Maximum
1 Gigohm Minimum
Humidity Load Life:
(1) 1000 Hours, +40°C
(2) 500 Hours, +60°C
(3) 500 Hours +85°C/85% RH
Capacitance Change
Dissipation Factor
Insulation Resistance
(1) & (2) Within ±2% of Initial value (3) Within ±10% of initial value
(1) & (2) 0.90% Maximum (3) 1.2% maximum
(1) 1 Gigohm Minimum (2) 0.5 Gigohm Minimum (3) 0.01 Gigohm min.
Solderability with
25% Wt Rosin-Methanol Flux
90% Minimum Coverage After 2.5 Second Dip into 255°C Solder Pot
RECOMMENDED REFLOW PROFILE
(maximum 2 times)
300
Peak Temperature
250 260°C
200
150
Cool Down
100
Time above 230°C
50 30 sec. max.
25 Ramp-up
25°C ~ 150°C
0 90 sec. max.
Pre-heat
150°C ~ 180°C
120 sec. max.
Time
Solder within 1 year. Storage at +30°C and 60% RH
RECOMMENDED LAND
PATTERN (mm)
Case Code EIA Size A B C
J1 0603 0.6 2.0 0.7
A1, A2
0805 0.8 2.4 1.1
B1, B2, B3
1206 1.8 3.6 1.4
C2, C3
1210 1.8 3.6 2.3
D5, D6
1913 3.0 5.6 3.0
E6, E7, E8
2416 4.0 7.0 3.8
A
B
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
www.SMTmagnetics.com
1
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NIC
NIC

NSHC221J50TRA1F Datasheet Preview

NSHC221J50TRA1F Datasheet

Stacked Film Capacitor Chips

No Preview Available !

NSHC221J50TRA1F pdf
Stacked Film Capacitor Chips
16V STANDARD PRODUCTS AND CASE SIZES
Part Number
NSHC101J16TRJ1F
NSHC121J16TRJ1F
NSHC151J16TRJ1F
NSHC181J16TRJ1F
NSHC221J16TRJ1F
NSHC271J16TRJ1F
NSHC331J16TRJ1F
NSHC391J16TRJ1F
NSHC471J16TRJ1F
NSHC561J16TRJ1F
NSHC681J16TRJ1F
NSHC821J16TRJ1F
NSHC102J16TRJ1F
NSHC122J16TRJ1F
NSHC152J16TRJ1F
NSHC182J16TRJ1F
NSHC222J16TRJ1F
NSHC272J16TRJ1F
NSHC332J16TRA1F
NSHC392J16TRA1F
NSHC472J16TRA1F
NSHC562J16TRA1F
NSHC682J16TRA1F
NSHC822J16TRA2F
NSHC103J16TRA2F
NSHC123J16TRB1F
NSHC153J16TRB1F
NSHC183J16TRB1F
NSHC223J16TRB1F
NSHC273J16TRB2F
NSHC333J16TRB2F
NSHC393J16TRB3F
NSHC473J16TRB3F
NSHC563J16TRC2F
NSHC683J16TRC2F
NSHC823J16TRC3F
NSHC104J16TRC3F
Cap.
Value
100pF
120
150
180
220
270
330
390
470
560
680
820
0.001
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.10
Cap.
Code
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
Size
Code
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
A1
A1
A1
A1
A1
A2
A2
B1
B1
B1
B1
B2
B2
B3
B3
C2
C2
C3
C3
Length
L ±0.2
1.6
2.0
3.2
3.2
Width
W
Height
H ±0.2
NSHC Series
p EIA
0.8 ± 0.15 0.7 ± 0.15 0.35 ± 0.20
0603
1.25 ± 0.2
1.6 ± 0.2
2.5 ± 0.2
0.9
0.45 ± 0.25
0805
1.1
0.9
0.65 ± 0.35
1206
1.1
1.5
1.5
0.65 ± 0.35
1210
2.1
OUTLINE DRAWING
Stacked Element
Terminations: 95.5% Sn, 4% Ag and
0.5% Cu over phenolic
resin/Ag/Ni/Cu over copper
base
H
p L2 p
L1
W


Part Number NSHC221J50TRA1F
Description Stacked Film Capacitor Chips
Maker NIC
Total Page 6 Pages
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