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SPSEMI
SPSEMI

TSM030 Datasheet Preview

TSM030 Datasheet

Surface Mount Devices

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TSM030 pdf
PPTC/TSM Series
Features
Surface Mount Devices
Lead free deivce
Size 5045mm/2018 mils
Surface Mount packaging for automated assembly
Agency recognition:
Applications
Almost anywhere there is a low voltage
power supply, up to DC60V and a load
to be protested, including:
Computer mother board, Modem.
Telecommunication equipments
A
B ZZZ
Dimensions (mm)
1.5 ±0.1
1.5 ±0.1
DC
3.4 ±0.1
Model
TSM030
TSM050
TSM100
TSM100/33
TSM150
TSM200
min
4.44
4.44
4.44
4.44
4.44
4.44
Product dimensions (mm)
AB
max min max min
4.72 4.22 4.93 0.60
4.72 4.22 4.93 0.60
4.72 4.22 4.93 0.45
4.72 4.22 4.93 0.45
4.72 4.22 4.93 0.45
4.72 4.22 4.93 0.45
C
max
1.10
1.10
0.80
0.80
0.80
0.80
D
min
0.30
0.30
0.30
0.30
0.30
0.30
Environmental Specifications
Test
Conditions
Passive aging
Humidity aging
Thermal shock
85,1000hrs
85,85%R.H.,168hrs
85,to-40,13times
Resistance to solvent
MIL-STD-202,Method 215
Vibration
MIL-STD-202,Method 201
Ambient operating confitions:-40to 85
Maximum surface of the device in the tripped state is 125
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
Terminal pad materials
Terminal pad solderability
Termination pad characteristics
Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
REV.2014.05.01
01 | www.spsemi.cn



SPSEMI
SPSEMI

TSM030 Datasheet Preview

TSM030 Datasheet

Surface Mount Devices

No Preview Available !

TSM030 pdf
PPTC/TSM Series
Model
TSM030
TSM050
TSM100
TSM100/33
TSM150
TSM200
Ihold
Itrip
Vmax
Imax
Pd
Rmin/max
R1max
Ihold
(A)
0.30
0.55
1.00
1.00
1.50
2.00
Electrical characteristics(25)
Itrip Vmax Imax Pd max Maximum Time To Trip Resistance
Current
Time Rmin Rmax
(A) (Vdc) (A) (w)
(A)
(S) (Ω) (Ω)
0.60 60 100 0.9
1.50
3.0 0.500 2.300
1.20 60 100 1.0
2.5
3.00 0.200 1.000
2.20 15 100 1.1
8.0
0.40 0.060 0.360
2.20 33 100 1.1
8.0
0.4 0.060 0.360
3.00 15.0 100 1.1
8.0
0.8 0.050 0.170
4.00 10 100 1.1
8.0
2.4 0.030 0.100
Hold Current:Maximum current device will not trip in 25still air.
Trip current:Minimum current at which the device will always trip in 25still air
Maximum operating volatge device can withstand without damage at ratde current(imax).
Maximum fault current device can withstand without damage at rated voltage(Vmax).
Typical power dissipatde from device when in the tripped state in 25still air.
Minimum/Maximum device resistance prior to tripping at 25.
Maximum resistance of device at 25measured one hour after trippde tripping.
*CAUTION
Model
TSM030
TSM050
TSM100
TSM100/33
TSM150
TSM200
Operation beyond the specified rating may result in damage and possible arcing.
Ihold versus tempetature
maximun ambient operating temperature(Tmao)vs.hold current(Ihold)
—40℃ —20℃ 0℃ 25℃ 40℃ 50℃
60℃
70℃
85℃
0.480 0.42 0.350 0.30 0.240 0.21
0.17
0.15 0.100
0.87 0.77 0.67 0.55 0.460 0.41
0.36
0.31
0.23
1.71 1.52 1.32 1.00 0.940 0.84
0.74
0.64
0.50
1.71 1.52 1.32 1.00 0.940 0.84
0.74
0.64
0.50
2.38 2.10 1.82 1.50 1.270 1.13
0.99
0.85
0.64
2.95 2.65 2.35 2.00 1.740 1.59
1.44
1.29
1.06
Thermal Derating Curve
Derating Curves for SMD2018 Series
160
140
120
100
80
60
40
20
0
-40
-20
0 20 40
Temperature (°C)
60
80
Typical Time-To-Trip At 25°C
Average Time Current Curves
100
10
1
0.1
0.01
0.001
0.1
1 10
Current In Amperes
050
100
150
200
133
100
030
Reel:
TSM030050
TSM100200
Package Information
1500pcs/Reel
2500pcs/Reel
REV.2014.05.01
02 | www.spsemi.cn


Part Number TSM030
Description Surface Mount Devices
Maker SPSEMI
Total Page 2 Pages
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