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STMicroelectronics Electronic Components Datasheet

80NF75L Datasheet

STP80NF75L

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80NF75L pdf
STP80NF75L
STB80NF75L STB80NF75L-1
N-CHANNEL 75V - 0.008 - 80A TO-220/D2PAK/I2PAK
STripFET™ II POWER MOSFET
TYPE
VDSS
RDS(on)
STP80NF75L
STB80NF75L
STB80NF75L-1
75 V
75 V
75 V
<0.01
<0.01
<0.01
s TYPICAL RDS(on) = 0.008
s EXCEPTIONAL dv/dt CAPABILITY
s 100% AVALANCHE TESTED
s LOW THRESHOLD DRIVE
ID
80 A
80 A
80 A
DESCRIPTION
This Power MOSFET is the latest development of
STMicroelectronis unique "Single Feature Size™"
strip-based process. The resulting transistor
shows extremely high packing density for low on-
resistance, rugged avalanche characteristics and
less critical alignment steps therefore a remark-
able manufacturing reproducibility.
APPLICATIONS
s HIGH CURRENT, HIGH SWITCHING SPEED
s MOTOR CONTROL, AUDIO AMPLIFIERS
s DC-DC & DC-AC CONVERTERS
s SOLENOID AND RELAY DRIVERS
3
1
D2PAK
TO-263
123
I2PAK
TO-262
3
2
1
TO-220
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
VDS Drain-source Voltage (VGS = 0)
VDGR
Drain-gate Voltage (RGS = 20 k)
VGS Gate- source Voltage
ID(•)
Drain Current (continuos) at TC = 25°C
ID Drain Current (continuos) at TC = 100°C
IDM(••) Drain Current (pulsed)
Ptot Total Dissipation at TC = 25°C
Derating Factor
dv/dt (1) Peak Diode Recovery voltage slope
EAS (2) Single Pulse Avalanche Energy
Tstg Storage Temperature
Tj Max. Operating Junction Temperature
()Current Limited by Package
(••) Pulse width limited by safe operating area.
November 2001
.
Value
75
75
± 16
80
80
320
300
2
12
930
Unit
V
V
V
A
A
A
W
W/°C
V/ns
mJ
-55 to 175
°C
(1) ISD 80A, di/dt 960A/µs, VDD V(BR)DSS, Tj TJMAX
(2) Starting Tj = 25 oC, ID = 40A, VDD= 40V
1/11
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STMicroelectronics Electronic Components Datasheet

80NF75L Datasheet

STP80NF75L

No Preview Available !

80NF75L pdf
STB80NF75L/-1/ STP80NF75L
THERMAL DATA
Rthj-case
Rthj-amb
Tl
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Maximum Lead Temperature For Soldering Purpose
Max
Max
Typ
0.5
62.5
300
ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)
OFF
Symbol
Parameter
Test Conditions
Min. Typ.
V(BR)DSS
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
75
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 16V
°C/W
°C/W
°C
Max.
1
10
±100
Unit
V
µA
µA
nA
ON (*)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 5 V
VGS = 10 V
ID = 40 A
ID = 40 A
Min.
1
Typ.
1.6
0.01
0.008
Max.
2.5
0.013
0.010
Unit
V
DYNAMIC
Symbol
gfs (*)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS = 25 V
ID = 40 A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
Typ.
50
5000
835
360
Max.
Unit
S
pF
pF
pF
2/11


Part Number 80NF75L
Description STP80NF75L
Maker STMicroelectronics
Total Page 11 Pages
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