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STMicroelectronics Electronic Components Datasheet

SPBT2532C2.AT Datasheet

Wireless Communication & Connectivity Modules

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SPBT2532C2.AT
Bluetooth® technology class-2 module
Features
Bluetooth® specification compliant V2.1
Output power class-2
Transmission rate up to 2 Mbps with EDR
Point-to-point
Packet types supported:
– ACL: DM1, DM3, DM5, DH1, DH3, DH5, 2-
DH1, 2-DH3, 2-DH5
Adaptive frequency hopping (AFH)
Efficient and flexible support for WLAN
coexistence in collocated scenario
Communication interfaces: (a)
– Fast UART up to 3.25 Mbit/s
– SPI interface
– I2C interface
– I2S interface
General I/O: (a)
– 4 general purpose I/O
– 4 x 12-bit A/D input
User interface:
– AT command set
Memory:
– 256 Kbytes Flash memory
– 48 Kbytes RAM memory
3.3 V single supply voltage
No external oscillator required
Module size: 10 x 13 mm
Description
The SPBT2532C2.AT is a surface-mount PCB
module that provides fully embedded,
ready-to-use Bluetooth wireless technology. It is
designed for maximum performance in a minimal
space and includes 4 general purpose (a) and 4
A/D IO lines (a), several serial interface options (a),
and up to 2 Mbps data throughput.
The re-programmable Flash memory contains
embedded firmware for serial cable replacement
using the Bluetooth SPP profile.
August 2009
a. All these resources cannot coexist at the same time;
they are shared on the 8 pins available for interface.
Standard configuration for AT command set is 4 pins
for UART and 4 pins for GPIO.
Doc ID 16089 Rev 1
1/51
www.st.com
51


STMicroelectronics Electronic Components Datasheet

SPBT2532C2.AT Datasheet

Wireless Communication & Connectivity Modules

No Preview Available !

SPBT2532C2.AT pdf
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Contents
SPBT2532C2.AT
1 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.2 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.3 Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1 DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6 Bluetooth parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.1 RF performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
8 Software architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.1 Lower layer stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
8.2 Upper layer stack: amp’ed UP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
8.3 AT command set: abSerial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
9 Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
9.1 Component drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
9.2 UART interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
9.3 Typical circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Appendix A Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2/51 Doc ID 16089 Rev 1


Part Number SPBT2532C2.AT
Description Wireless Communication & Connectivity Modules
Maker ST Microelectronics
Total Page 30 Pages
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