Absolute Maximum Ratings (Ta=25°C)
IF 25 mA
Forward Current Derating (Ta ≥ 110°C)
Peak Transient Forward Current
Peak Transient Forward Current Derating (Ta ≥ 110°C)
VR 5 V
Output Current (Ta ≤ 125℃)
IO 25 mA
VO 6 V
Output Power Dissipation
PO 80 mW
Output Power Dissipation Derating (Ta ≥ 110°C)
Operating Temperature Range
-40 to 125
Storage Temperature Range
-55 to 150
Lead Soldering Temperature (10 s)
Tsol 260 °C
Isolation Voltage (AC,1 min.,R.H.≤ 60%,Ta=25°C)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width ≤ 1ms, duty = 50%.
Note 2: This device is regarded as a two terminal device: pins 1, 2, 3 and 4 are shorted together,
as are pins 5, 6, 7 and 8.
Recommended Operating Conditions
Symbol Min Typ. Max Unit
Input Current , High Level
Input Voltage , Low Level
IFH 7.5 - 15 mA
VFL 0 - 0.8 V
VCC 4.5 - 5.5 V
Topr -40 - 125 °C
* This item denotes operating range, not meaning of recommended operating conditions.
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
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