Absolute Maximum Ratings (Ta = 25°C)
Forward current derating (Ta ≥ 25°C)
Off-state output terminal voltage
(Ta ≥ 50°C) C connection
Lead soldering temperature (10 s)
(AC, 1 minute, R.H. ≤ 60%)
−55 to 125
−40 to 85
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc.).
Note 1: Device considered a two-terminal device: Pins 1 and 2 shorted together, and pins 3 and 4 shorted together.
This device is sensitive to electrostatic discharge. When using this device, please ensure that all tools and equipment
Recommended Operating Conditions
Symbol Min Typ. Max Unit
⎯ ⎯ 20 V
5 10 20 mA
-20 ⎯ 65 °C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.