5. Internal Circuit
TLP3544
Fig. 5.1 Internal Circuit
6. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25)
Characteristics
Symbol Note
Rating
Unit
LED Input forward current
Input forward current derating
Input forward current (pulsed)
Input reverse voltage
Input power dissipation
Junction temperature
Detector OFF-state output terminal voltage
ON-state current (A connection)
ON-state current (B connection)
ON-state current (C connection)
ON-state current derating (A connection)
ON-state current derating (B connection)
ON-state current derating (C connection)
ON-state current (pulsed)
Output power dissipation
Junction temperature
(Ta ≥ 25)
(100 µs pulse, 100 pps)
(Ta ≥ 25)
(Ta ≥ 25)
(Ta ≥ 25)
(t = 100 ms, Duty = 1/10)
IF
∆IF/∆Ta
IFP
VR
PD
Tj
VOFF
ION
ION
ION
∆ION/∆Ta
∆ION/∆Ta
∆ION/∆Ta
IONP
PO
Tj
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
30
-0.3
1
5
50
125
40
3.5
3.5
7
-35
-35
-70
10.5
500
125
mA
mA/
A
V
mW
V
A
mA/
A
mW
Common Storage temperature
Tstg -55 to 125
Operating temperature
Topr -40 to 85
Lead soldering temperature
(10 s)
Tsol
260
Isolation voltage
AC, 1 min, R.H. ≤ 60%
BVS (Note 2)
2500
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: For an application circuit example, see Fig. 12.2.
Note 2: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6
are shorted together.
2 2012-03-16
Rev.2.0
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