Absolute Maximum Rating (Ta = 25°C)
Pulse forward current
Peak transient forward current
Output power dissipation
Storage temperature range
Operating temperature range
Lead solder temperature
−55 to 125
−40 to 85
Note: Using continuously under heavy loads (e.g. application of high temperature/current/voltage and a significant
change in temperature, etc.) may cause this product to decrease in reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Note 1: 50% duty cycle, 1 ms pulse width.
Note 2: Pulse width ≤1 μs, 300 pps.
Note 3: 1 minute maximum.
Note 4: Soldering is performed 2mm from the bottom of the package.
Note 5: AC, 1min, R.H. ≤ 60%
Device considered a two-terminal device: 1, 2 and 3 shorted together and pins 4, 5 and 6 shorted together.
Recommended Operating Conditions
Symbol Min Typ. Max Unit
‘L’ level input voltage
‘H’ level input current
0 ― 70 °C
Note: The recommended operating conditions are given as a design guideline to obtain the expected performance of
the device. In addition, each item is an independent guideline. In developing designs using this product, please
confirm the specified characteristics shown in this document.
* 6.3 mA is a guard banded value which allows for at least 20% CTR degradation.
Initial input current threshold is 5 mA or less.
** This item denotes the operating range and not the recommended operating conditions.