Recommended Operating Conditions
Symbol Min. Typ. Max. Unit
Input current, on
Input current, off
Enable voltage high
Enable voltage low
Fan out (TTL load)
IF(ON) 1.6 ―
IF(OFF) 0 ― 0.1 mA
VEH 2.0 ― 20 V
VEL 0 ― 0.8 V
0 ― 85 °C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Absolute Maximum Ratings (no derating required up to 70°C)
Peak transient forward current
Three state enable voltage
Total package power dissipation
Operating temperature range
Storage temperature range
Lead solder temperature (10s) (**)
Isolation voltage (AC 1min., R.H. ≤ 60%,Ta = 25°C)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 1) Pulse width 1μs 300pps.
(Note 2) Derate 4.5mW / °C above 70°C ambient temperature.
(Note 3) Device considered a two terminal device: Pins 1, 2, 3 and 4 shorted together, and pins 5,6,7 and 8 shorted
(**) 1.6mm below seating plane.