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Vishay Intertechnology Electronic Components Datasheet

FCSP140TR Datasheet

Chip Scale Package Schottky Barrier Rectifier

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FCSP140TR pdf
FlipKY®, 1 A
FCSP140TR
Vishay High Power Products
FlipKY®
PRODUCT SUMMARY
IF(AV)
VR
1A
40 V
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MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
IF Rectangular waveform
VRRM
IFSM
tp = 5 µs sine
VF 1.0 Apk, TJ = 125 °C
TJ Range
VOLTAGE RATINGS
PARAMETER
Maximum DC reverse voltage
Maximum working peak reverse voltage
SYMBOL
VR
VRWM
FEATURES
• Ultra low VF per footprint area
• Low thermal resistance
• One-fifth footprint of SMA
• Super low profile (< 0.7 mm)
RoHS
COMPLIANT
• Available tested on tape and reel
• Small footprint, surface mountable
• Low forward voltage drop
• High frequency operation
• Guard ring for enhanced ruggedness and long term
reliability
• Lead (Pb)-free
• Designed for consumer level
DESCRIPTION
True chip-scale packaging is available from Vishay HPP.
The FCSP140TR surface mount Schottky rectifier has been
designed for applications requiring low forward drop and very
small foot prints on PC boards. Typical applications are in
disk drives, switching power supplies, converters,
freewheeling diodes, battery charging, and reverse battery
protection.
The FlipKY® package, is one-fifth the footprint of a
comparable SMA package and has a profile of less then
0.7 mm. Combined with the low thermal resistance of the die
level device, this makes the FlipKY the best device for
applications where printed circuit board space is at a
premium and in extremely thin application environments
such as battery packs, cell phones and PCMCIA cards.
VALUES
1.0
40
250
0.38
- 55 to 150
UNITS
A
V
A
V
°C
FCSP140TR
40
UNITS
V
Document Number: 94279
Revision: 02-Apr-08
For technical questions, contact: diodes-tech@vishay.com
www.vishay.com
1


Vishay Intertechnology Electronic Components Datasheet

FCSP140TR Datasheet

Chip Scale Package Schottky Barrier Rectifier

No Preview Available !

FCSP140TR pdf
FCSP140TR
Vishay High Power Products
FlipKY®, 1 A
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Maximum average forward current
IF(AV)
Maximum peak one cycle
non-repetitive surge current at 25 °C
IFSM
Non-repetitive avalanche energy
Repetitive avalanche current
EAS
IAR
TEST CONDITIONS
50 % duty cycle at TPCB = 112 °C, rectangular waveform
5 µs sine or 3 µs rect. pulse
10 ms sine or 6 ms rect. pulse
Following any rated
load condition and with
rated VRRM applied
TJ = 25 °C, IAS = 2.0 A, L = 5.0 mH
Current decaying linearly to zero in 1 µs
Frequency limited by TJ maximum VA = 1.5 x VR typical
VALUES
1.0
250
21
10
2.0
UNITS
A
mJ
A
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum forward voltage drop
See fig. 1
VFM (1)
Maximum reverse leakage current
See fig. 2
IRM (1)
Maximum junction capacitance
CT
Maximum voltage rate of change
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(1) Pulse width < 300 µs, duty cycle < 2 %
dV/dt
TEST CONDITIONS
1A
TJ = 25 °C
2A
1A
TJ = 125 °C
2A
VR = Rated VR
VR = 20 V
VR = 10 V
TJ = 25 °C
VR = 5 V
VR = Rated VR
VR = 20 V
VR = 10 V
TJ = 125 °C
VR = 5 V
VR = 5 VDC (test signal range 100 kHz to 1 MHz) 25 °C
Rated VR
TYP.
0.43
0.51
0.34
0.46
10
3.5
2
1.5
9.0
3.5
2.5
2
-
-
MAX. UNITS
0.48
0.56
V
0.38
0.53
80
20
µA
10
5
20
8
mA
6
5
160 pF
10 000 V/µs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TJ (1), TStg
Typical thermal resistance
junction to PCB
Typical thermal resistance
junction to ambient
RthJL (2)
RthJA
DC operation
TEST CONDITIONS
Notes
(1) d----P-----t-o---t < ------1-------- thermal runaway condition for a diode on its own heatsink
dTJ RthJA
(2) Mounted on 1" square PCB
VALUES
- 55 to 150
40
62
UNITS
°C
°C/W
www.vishay.com
2
For technical questions, contact: diodes-tech@vishay.com
Document Number: 94279
Revision: 02-Apr-08


Part Number FCSP140TR
Description Chip Scale Package Schottky Barrier Rectifier
Maker Vishay Siliconix
Total Page 5 Pages
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