Full PDF Text Transcription for MB1608xxxx5x (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
MB1608xxxx5x. For precise diagrams, and layout, please refer to the original PDF.
SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 1 MULTILAYER CHIP BEAD CONFIGURATION & DIMENSIONS ¡G A ABC'S DWG NO. ABC'S ITEM NO. MB1608□□□□5□ ¢¹¡O www.DataSheet4U.co...
View more extracted text
¡G A ABC'S DWG NO. ABC'S ITEM NO. MB1608□□□□5□ ¢¹¡O www.DataSheet4U.com D D C B I G PCB Pattern I Unit : m/m Series MB1608 A 1.60±0.15 B 0.80±0.15 C 0.80±0.15 D 0.30±0.20 G 0.7 H 0.7 H I 0.7 ¢º¡O SCHEMATIC DIAGRAM ¡G ¢»¡O MATERIALS ¡G a¡ b¡ c¡ d¡ Body O Ferrite ¡ G G Internal conductor O Silver or Ag / Pd ¡ Remark O Lead¡ content G 1600ppm typ. include ferrite a b c Terminal electrode O Ag/Ni/Sn (Lead¡ contant 100ppm max.) G ¢¼¡O GENERAL SPECIFICATION ¡G a¡ b¡ c¡ Storage temp. O -40 ---- +105 ¡ ¡ F Type MB1608 d¡ Solderability O F ( kgf ) 0.5 time ( sec ) Temperature ( ¢J 250 50sec max. G ¢ G Peak Temp¡ J J Operating temp.
MB1608xxxx5x Datasheet
