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AK594096AG - 4194304 Word x 9 Bit CMOS Dynamic Random Access Memory

This page provides the datasheet information for the AK594096AG, a member of the AK594096AS 4194304 Word x 9 Bit CMOS Dynamic Random Access Memory family.

Description

The Accutek AK594096A high density memory module is a CMOS random access memory organized in 4 Meg x 9 bit words.

The assembly consists of nine standard 4 Meg x 1 DRAMs in plastic leaded chip carriers (SOJ) mounted on the front side of a printed circuit board.

Features

  • 4,194,304 x 9 bit organization.
  • Optional 30 Pad leadless SIM (Single In-Line Module) or 30 Pin leaded SIP (Single In-Line Package).
  • JEDEC standard pinout.
  • Common CAS and RAS control for the lower eight bits.
  • Separate PCAS for control for D9 and Q9.
  • CAS-before-RAS refresh.
  • Power 4.45 Watt Max Active (80 nSEC) 3.96 Watt Max Active (100 nSEC) 49.5 mW Max Standby.
  • Operating free air temperature 00C to 700C.
  • Upward compatible with AK5916384.
  • Downward.

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Datasheet preview – AK594096AG

Datasheet Details

Part number AK594096AG
Manufacturer ACCUTEK
File Size 154.89 KB
Description 4194304 Word x 9 Bit CMOS Dynamic Random Access Memory
Datasheet download datasheet AK594096AG Datasheet
Additional preview pages of the AK594096AG datasheet.

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Other Datasheets by ACCUTEK
  • AK594096AS - 4194304 Word x 9 Bit CMOS Dynamic Random Access Memory
  • AK594096BG - 4194304 Word by 9 Bit CMOS Dynamic Random Access Memory
  • AK594096BS - 4194304 Word by 9 Bit CMOS Dynamic Random Access Memory
  • AK591024AG - 1048576 Word x 9 Bit CMOS Dynamic Random Access Memory
  • AK591024AS - 1048576 Word x 9 Bit CMOS Dynamic Random Access Memory
  • AK5916384G - 16777216 Word by 9 Bit CMOS Dynamic Random Access Memory
  • AK5916384S - 16777216 Word by 9 Bit CMOS Dynamic Random Access Memory
  • AK59256AG - 262144 Word by 32 Bit CMOS Dynamic Random Access Memory

Full PDF Text Transcription

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MICROCIRCUIT CORPORATION DESCRIPTION The Accutek AK594096A high density memory module is a CMOS random access memory organized in 4 Meg x 9 bit words. The assembly consists of nine standard 4 Meg x 1 DRAMs in plastic leaded chip carriers (SOJ) mounted on the front side of a printed circuit board. The module can be configured as a leadless 30 pad SIM or a leaded 30 pin SIP. The module is only 0.800 inches high (same height as a standard 1 Meg module), making it ideally suited for applications with low height restrictions. The operation of the AK594096A is identical to nine 4 Meg x 1 DRAMs. For the lower eight bits data input is tied to the data output and brought out separately for each device, with common RAS, CAS control.
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