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AMIS-710228 Datasheet Preview

AMIS-710228 Datasheet

(AMIS-710227 /- AMIS-710229) 200dpi CIS Module

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AMIS-710227, AMIS-710228, AMIS-710229: 200dpi CIS Module Data Sheet
1.0 General Description
The AMIS-710227 (PI227MC-A4), AMIS-710228 (PI228MC-A4) and AMIS-710229 (PI229MC-A4) are a family of contact image sensor
(CIS) modules. As a family group they are called AMIS-710227/228/229 modules. They are long-contact image sensor modules using
MOS image sensor technology for high-speed performance and high sensitivity. They contain their own complete optical system
including the light source; accordingly, they make a very compact imaging system. The four parallel video outputs give this family of CIS
modules their high-speed performance. They all possess identical electrical circuit components, as well as the mechanical and optical
components, except for their LED light sources. Accordingly, they differ in their specification because the different light sources limits
the effective high-speed performance. The three modules are suitable for scanning A4 size (216mm) documents with 8 dots per
millimeter (dpm) resolution. Applications include document scanning, mark readers, gaming and office automation equipment.
2.0 Key Features
Light source, lens and sensor are integrated into a single module
Ultra-high-speed
Four parallel analog video outputs clocked at 5.0MHz
90µsec/line scanning speed @ 5.0MHz clock rate with optional light sources, selected from the option of three above modules
8dpm resolution, 216mm scanning length
Wide dynamic range
LED light source (selectable among the three above modules)
Standard A4 size 14mm x 19mm x 232mm
Low power
Light weight
3.0 Functional Description
Each of the three modules in the family, AMIS-710227/228/229, consists of four major components. The first of them is the printed
wwcwirc.DuaittabSohaeredt4U(P.cCoBm) on which the 27 imaging chips, AMIS-720220 (PI3020), are bonded. These sensor chips, produced by AMI
Semiconductor, are monolithic devices with 64 photo-sensing elements. Each of 27 chips are complete self-contained scanning chips
and have their control circuits integrated in the chips, so that they can be cascaded to provide 1728 photo-element modules. The AMIS-
720220 chips are integrated with the photo sensors' associated multiplex switches, a digital shift register and chip selection switch. The
chip's shift register sequentially clocks out the integrated image charges from each sensing element and passes them through the chip-
select switch and out onto the video line. The chip-select switches are sequentially switched as each of the predecessor chips
completes its scan. These 27 sensors, bonded on a PCB, are grouped into four sub-cascaded sections. Each contiguously cascaded
chips section is connected on separate video lines, resulting in four video outputs VOUT1, VOUT2, VOUT3, and VOUT4. Before the
signal, charges from the four video lines appear at their respective outputs where they are converted to signal voltages by four on-board
buffer amplifiers, one for each of its corresponding video section. The first three sections VOUT1, VOUT2 and VOUT3 have seven
sensor chips, while the VOUT4 has six sensor chips. Since each sensor chip has 64 pixels, there are a total of 1728 pixels. See Figure
1.
AMI Semiconductor – May 06, M-20548-001
www.amis.com
1




AMI SEMICONDUCTOR

AMIS-710228 Datasheet Preview

AMIS-710228 Datasheet

(AMIS-710227 /- AMIS-710229) 200dpi CIS Module

No Preview Available !

AMIS-710227, AMIS-710228, AMIS-710229: 200dpi CIS Module Data Sheet
Figure 1: AMIS-710227/228/229 Module Block Diagram
(See Table 4-A for Pin Out Designation)
Mounted in the module housing along with the PCB is the second major component. It is a one-to-one graded indexed micro lens array
that focuses the scanned documents' image onto the sensing line of the sensor chips. The third major component, mounted in the
module, is the LED light source. See Figure 2. This pictorial cross section shows the LED bar light source and its illumination path as it
reflects the image from the document and focuses through the ROD lens on to its image sensing line of the sensing chips. All
wwcwom.DpaotanSehnetest4aUre.cohmoused in a small plastic housing and covered with the fourth major component, a glass window. This cover glass not
only serves to protect all of the critical components within the housing from dust, but also serves a minor role in the optical system.
Together with rest of the module's optical system, the module is adjusted to obtain the optimum depth-of-focus. See Section 10: MTF
Graph and its Discussion.
AMI Semiconductor – May 06, M-20548-001
www.amis.com
2


Part Number AMIS-710228
Description (AMIS-710227 /- AMIS-710229) 200dpi CIS Module
Maker AMI SEMICONDUCTOR
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AMIS-710228 Datasheet PDF






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