900,000+ datasheet pdf search and download

Datasheet4U offers most rated semiconductors data sheet pdf






AMI SEMICONDUCTOR

AMIS-720233-B Datasheet Preview

AMIS-720233-B Datasheet

Image Sensor

No Preview Available !

AMIS-720233-B: Contact Image Sensor
Data Sheet
1.0 General Description
The AMIS-720233-B (PI3033B) contact image sensor (CIS) chip is a 200 dot per inch (dpi) resolution, linear array image sensor chip.
The sensor chip is processed with AMI Semiconductor’s proprietary CMOS image sensing technology. Designed for cascading multiple
chips in a series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a printed circuit board (PCB) in
varying sensing array lengths. This CIS chip offers image reading widths to suit document scanners found in facsimile, scanner, check
reader and office automation equipment.
Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 64 detector elements, their associated multiplexing
switches, buffers and a chip selector. The detector's element-to-element spacing is approximately 125um. The size of each chip without
scribe lines is 7950um by 500um. Each sensor chip has eight bonding pads. Only seven are used to make the CIS modules. The pad
symbols and functions are described in Table 1.
Buffer
SP
7950 m
Row of 64 Sensors
and Video Signal
Multiplexers
Readout Shift Register
500 m
Buffer
CP VDD DGND
Chip
Select
IOUT RSTLEV
Buffer
AGND EOS
Figure 1: AMIS-720233-B Block Diagram
www.DataSheet4U.com
Table 1: Pad Symbols and Functions
Symbol
Function
SP Start pulse: input to start the line scan
CP Clock pulse: input to clock the shift register
VDD
Positive supply: +5V supply connected to substrate
DGND
Digital ground: connection topside common
RSTLEV
A bias pad: not used, left floating
IOUT
Signal current output: output for video signal current
AGND
Analog ground: connection topside common
EOS
End-of-scan pulse: output from the shift register at end-of-scan
AMI Semiconductor –May 06, M-20567-001
www.amis.com
1




AMI SEMICONDUCTOR

AMIS-720233-B Datasheet Preview

AMIS-720233-B Datasheet

Image Sensor

No Preview Available !

AMIS-720233-B: Contact Image Sensor
Data Sheet
2.0 Bonding Pad Outputs Locations and Die Dimensions
Figure 2 shows image sensors die dimension and the bonding pad locations for the AMIS-720233-B sensor chip. The location is
referenced to the lower left corner of the die. Note RSTLV, bias pad is not used.
www.DataSheet4U.com
Figure 2: Bonding Pad and Chip Layout
AMI Semiconductor –May 06, M-20567-001
www.amis.com
2


Part Number AMIS-720233-B
Description Image Sensor
Maker AMI SEMICONDUCTOR
PDF Download

AMIS-720233-B Datasheet PDF






Similar Datasheet

1 AMIS-720233-B Image Sensor
AMI SEMICONDUCTOR





Part Number Start With

0    1    2    3    4    5    6    7    8    9    A    B    C    D    E    F    G    H    I    J    K    L    M    N    O    P    Q    R    S    T    U    V    W    X    Y    Z



Site map

Webmaste! click here

Contact us

Buy Components

Privacy Policy