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AMI SEMICONDUCTOR

AMIS-720341-A Datasheet Preview

AMIS-720341-A Datasheet

Image Sensor

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AMIS-720341-A: Contact Image Sensor
Data Sheet
1.0 Description
AMI Semiconductor’s AMIS-720341-A (PI3041A) contact image sensor (CIS) chip is a 300 dots per inch (dpi) resolution, linear array
image sensor chip. The sensor chip is processed using a CMOS image sensing technology and it belongs to the Image Sensor Product
Line (ISPL) group within AMIS. Designed for cascading multiple chips in a series, the image sensor chips use a chip-on-board process.
They are bonded end-to-end on a printed circuit board (PCB). This bonding process allows the CIS module manufacturers to produce
variable CIS module lengths in increments of the chip array lengths. Hence, the modules are easily applied in a large number of
document scanners found in today’s facsimile market. Some examples of these large document scanners are those that produce wide
format maps and architectural drawings, down to the narrow width scanners, such as those found in check readers, lotto tickets,
entrance gates tickets, etc. This is not to exclude office automation equipment, which requires an even more variety in scanning widths,
as well as those with special mechanically configurations.
Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 96 detector elements, their associated
multiplexing switches, buffers, and a chip selector. The detector's element-to-element spacing is approximately 83.3µm. The size of
each chip without scribe lines is 8080µm by 380µm. Each sensor chip has seven bonding pads. The pad symbols and functions are
described in Table 1.
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Buffer
SP
8080 mm
Row of 96 Sensors
and Video Signal
Multiplexers
Readout Shift Register
Buffer
CP VDD DGND
Chip
Select
IOUT
380 mm
Buffer
AGND EOS
Figure 1: AMIS-720341-A Block Diagram
Table 1: Pad Symbols and Functions
Symbol
Function
SP Start pulse: input clock to start the line scan
CP Clock pulse: input clock to clock of the shift register
VDD
Positive supply: +5V supply connected to substrate
DGND
Digital ground: connection topside common
IOUT
Signal current output: output for video signal current
AGND
Analog ground: connection topside common
EOS
End-of-scan pulse: output from the shift register at end-of-scan
AMI Semiconductor – May 06, M-20570-001
www.amis.com
1




AMI SEMICONDUCTOR

AMIS-720341-A Datasheet Preview

AMIS-720341-A Datasheet

Image Sensor

No Preview Available !

AMIS-720341-A: Contact Image Sensor
Data Sheet
2.0 Bonding Pad Outputs Locations and Die Dimensions
Figure 2 shows the die dimensions of the image sensor and the bonding pad locations for the AMIS-720341-A sensor chip. The location
is referenced to the lower left corner of the die.
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Figure 2: Bonding Pad and Chip Layout
AMI Semiconductor – May 06, M-20570-001
www.amis.com
2


Part Number AMIS-720341-A
Description Image Sensor
Maker AMI SEMICONDUCTOR
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