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AMI SEMICONDUCTOR

AMIS-720658 Datasheet Preview

AMIS-720658 Datasheet

Image Sensor

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AMIS-720658: Contact Image Sensor
Data Sheet
1.0 General Description
AMI Semiconductor’s AMIS-720658 (PI6058) contact image sensor (CIS) is a selectable 600 or 300 dot per inch (dpi) resolution linear
image sensor, which employs AMI Semiconductor’s proprietary CMOS image sensing technology. The sensor contains an on-chip
output amplifier, power down circuitry and parallel transfer features that are uniquely combined with the present-day active-pixel-sensor
technology. The image sensors are designed to be cascaded end-to-end on a printed circuit board (PCB) and packaged in an image
sensing module. Applications for the sensor array include facsimiles, PC scanners, check readers, and office automation equipment.
Figure 1 is a block diagram of the sensor. Each sensor consists of 344 active pixels, their associated multiplexing switches, buffers and
an output amplifier circuit with a power down feature. The sensors pixel-pixel spacing is approximately 42.3µm. The size of each sensor
without the scribe lines is 14560µm by 335µm.
2.0 Key Features
600 and 300dpi selectable resolutions
344 or 172 image sensor elements (pixels)
42.3µm (600dpi) pixel center-to-center spacing
On-chip amplifier
Single 3.3V power supply
3.3V input clocks and control signals
4.0MHz maximum pixel rate
Parallel / integrate and transfer
Power-down circuit
High sensitivity
Low power
Low noise
www.DataSheet4U.com
22.95µm
42.3µm
14560µm
1
23
4
Row of 344 Pixels (600dpi)
and Video Line Multiplexer
342 343 344
SI GBST
CLK
Parallel Transfer, Storage Cells and Readout Registers
Scan Direction
SIC SR
Amplifier, Power-
Down and Offset
Control
VDD VOUT
VSS VREF
Figure 1: Sensor Block Diagram
SO
335µm
AMI Semiconductor – Jul 06, M-20503-007
www.amis.com
1




AMI SEMICONDUCTOR

AMIS-720658 Datasheet Preview

AMIS-720658 Datasheet

Image Sensor

No Preview Available !

AMIS-720658: Contact Image Sensor
Data Sheet
3.0 Unique Features
There are six unique features incorporated into the AMIS-720658 which improve the sensor’s performance.
3.1 Pixel-to-pixel Offset Cancellation Circuit
The sensor employs a pixel-to-pixel offset cancellation circuit, which reduces the fixed pattern noise (FPN), and amplifier offsets. In
addition, this innovative circuit design greatly improves the optical linearity and low noise sensitivity.
3.2 Parallel Integrate, Transfer and Hold
The sensor has a parallel integrate, transfer and hold feature, which allows the sensor to be read out while photon integration is taking
place. These features are approached through the use of an integrate-and-hold cell, located at each pixel site. Each pixel’s charge is
read from its storage site as the sensor’s shift register sequentially transfers each pixel’s charge onto a common video line.
3.3 Dual Scan Initiation Inputs, GBST and SI
Each sensor has two scan initiation inputs, the global start pulse (GBST) and the start pulse (SI), which are compatible with standard
3.3V CMOS clocks. These clocks help to reduce the sensor-to-sensor transition FPN by initializing and preprocessing all sensors
simultaneously before they start their readout scan. The internal shift register starts the scan after GBST is clocked in on the falling
edge of the clock input (CLK).
During the first 82 clock cycles following a GBST pulse, all the pixels of all the cascaded sensors cycle through their pre-scan
initialization process that reduces FPN and reset noise.
A sequence of cascaded sensors has a unique first sensor and identically behaving subsequent sensors. The start input control (SIC)
defines whether a sensor will be the first sensor that self-starts the readout of its pixels or will be a subsequent sensor that waits for the
SI before starting the readout of its pixels. With its SIC tied high (Vdd), the first sensor self-starts the readout of its pixels after 82 clock
cycles of delay. With their SIC tied low (Ground), all of the subsequent sensors delay their readout of their pixels until after they receive
a SI pulse. Furthermore, the first sensor’s SI is left unconnected, while the subsequent sensors all have their SI connected to the end-
of-scan (SO) of their respective preceding sensor. Just prior to finishing its readout of its pixels, each sensor will send a SO pulse to its
respective subsequent sensor so that its respective subsequent sensor will continue the readout of pixels without a pause or gap in
readout. The external module-level start pulse (SP) is connected to all of the sensors' GBST inputs.
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mode,
rising
when the first sensor completes its scan, its
edge of the 11th last pixel, in order to have a
SO appears on the rising
continuous pixel readout
edge of 416th clock
between sensors in
cycle after
a module.
This SO enters as the SI clock of the second and subsequent sensors; hence all subsequent sensors will start their register scan after
each of the preceding sensors completes its scan.
3.4 Power Saving
Each sensor incorporates a power-saving feature when multiple sensors are cascaded together to form a linear imaging array. When a
particular sensor is selected to be read out, the SIC on each sensor selects a unique feature of powering up that sensor’s output
amplifier and powering it down when not selected.
3.5 Common Reference Voltage Between Cascaded Sensors
Each sensor has an input bias control (VREF), which serves as an offset voltage reference. Each bias control pad is tied to its own
amplifier’s reference bias input. In operation, these pads on every sensor are connected together. Each sensor then “shares” the same
bias level to maintain a constant bias among all of the sensors.
3.6 Selectable Resolutions of 600dpi and 300dpi
The select resolution input (SR) is connected to high (Vdd) or to low (Ground) to set the sensor to operate in the 600dpi or 300dpi
mode, respectively. In the 600dpi mode, all 344 pixels are clocked out, whereas in the 300dpi mode, Pixels 1 and 2 are combined, 3
and 4 are combined and so on up to Pixels 343 and 344 being combined. One half of the pixel amplifiers and one half of the scanning
AMI Semiconductor – Jul 06, M-20503-007
www.amis.com
2


Part Number AMIS-720658
Description Image Sensor
Maker AMI SEMICONDUCTOR
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