PI3033B Datasheet | AMI SEMICONDUCTOR

Description : Peripheral Imaging Corporation PI3033B CIS, Contact Image Sensor, chip is a 200 dot per inch resolution, linear array image sensor chip. The sensor chip is processed with PIC’s proprietary CMOS Image Sensing Technology. Designed for cascading multiple chips in a series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a printed circuit board (PCB) in varying sensing array lengths. Accordingly offering image reading widths to suit document scanners found in facsimile, scanner, check reader, and office automation equipment. Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 64 detector elements, their associated multiplexing switches, buffers, and a chip selector. The detector's elementto-element spacing is approximately 125 um. The size of each chip without scribe lines is 7950 um by 500 um. Each sensor chip has 8 bonding pads. Only 7 are used to make the CIS Modules. The pad symbols and functions are described in Table 1. 7950 m Row of 64 Sensors and Video Signal Multiplexers Readout Shift Register 500 m Buffer SP Buffer CP VDD DGND Chip Select IOUT RSTLEV Buffer AGND EOS Figure 1. PI3033B Block Diagram SYMBOL SP CP VDD DGND RSTLEV IOUT AGND EOS FUNCTION Start Pulse: Input to start the line scan. Clock Pulse: Input to clock the Shift Register. Positive Supply: +5 volt supply connected to substrate. Digital Ground: Connection topside mon A Bias Pad: Not used, left floating Signal Current Output: Output for video signal current Analog Ground: Connection topside mon End of Scan Pulse: Output from the shift register at end of scan. Table 1. Pad Symbols and Functions Page 2 of 13 Date: 03/18/05 .. Preliminary PI3033B datasheet Bonding Pad Outputs Locations and Die Dimensions Figure 2 shows image sensors die dimension and the bonding pad locations for PI3033B Sensor Chip. The location is referenced to the lower left corner of the die. Note RSTLV, bias, pad is not used. Figure 2....