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ASMT-Mx20 - 3W Power LED Light Source

Download the ASMT-Mx20 datasheet PDF. This datasheet also covers the ASMT-MX20 variant, as both devices belong to the same 3w power led light source family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Available in white color Energy efficient Exposed pad for excellent heat transfer Suitable for reflow soldering process High current operation up to 700 mA Long operation life Wide viewing angle Silicone encapsulation ESD of 2 kV MSL 2A 3W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design h.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (ASMT-MX20_AVAGOTECHNOLOGIES.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number ASMT-Mx20
Manufacturer AVAGO TECHNOLOGIES
File Size 226.50 KB
Description 3W Power LED Light Source
Datasheet download datasheet ASMT-Mx20 Datasheet

📁 Similar Datasheet

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Other Datasheets by AVAGO TECHNOLOGIES

Part Number Description
ASMT-Mx00 1 W Power LED Light Source
ASMT-MB00-NAE00 Mid- and High-Power LEDs
ASMT-MG00-NGJ00 Mid- and High-Power LEDs
ASMT-MW00-NJK00 Mid- and High-Power LEDs
ASMT-MW00-NJK01 Mid- and High-Power LEDs

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
ASMT-Mx20 3W Power LED Light Source Data Sheet www.DataSheet4U.com Description Features • • • • • • • • • • Available in white color Energy efficient Exposed pad for excellent heat transfer Suitable for reflow soldering process High current operation up to 700 mA Long operation life Wide viewing angle Silicone encapsulation ESD of 2 kV MSL 2A 3W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. The low profile package design is suitable for a wide variety of applications especially where height is a constraint. The package is compatible with reflow soldering process.