AP9406MP Description
Exposed pad SO-8 (Drain contact on the Backside) D The Advanced Power MOSFETs from APEC provide the designer with the best bination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The exposed pad SO-8 package provides the backside heat sink (Drain) to release thermal and reduce the package temperature and is good for low voltage applications such as high current DC/DC...