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C6011 - 2SC6011

General Description

By adapting the Sanken unique wafer-thinner technique, these NPN power transistors achieve power-up by decreasing thermal resistance, and provide higher voltage avalanche breakdown rating.The high power-handling capacity of the TO-3Ppackage allows a smaller footprint on the circuit board design.

Key Features

  • Small package (TO-3P).
  • High power handling capacity, 160 W.
  • Improved sound output by reduced on-chip impedance.
  • For professional audio (PA).

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Full PDF Text Transcription for C6011 (Reference)

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2SC6011 Audio Amplification Transistor Features and Benefits ▪ Small package (TO-3P) ▪ High power handling capacity, 160 W ▪ Improved sound output by reduced on-chip impe...

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ndling capacity, 160 W ▪ Improved sound output by reduced on-chip impedance ▪ For professional audio (PA) applications, VCEO = 200 V versions available ▪ Complementary to 2SA2151 ▪ Recommended output driver: 2SC4832 Package: 3 Lead TO-3P Description By adapting the Sanken unique wafer-thinner technique, these NPN power transistors achieve power-up by decreasing thermal resistance, and provide higher voltage avalanche breakdown rating.The high power-handling capacity of the TO-3Ppackage allows a smaller footprint on the circuit board design.

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