EF102PG
Features
- Low profile surface mounted application in order to optimize board space.
- Trr less than 25ns for high efficiency
- High current & surge capability.
- Low forward dropdown voltage
- Glass passivated chip junction.
- Lead-free parts meet environmental standards of
MIL-STD-19500 /228
- Suffix "-H" indicates Halogen free parts, ex. EF101PG-H.
Mechanical data
- Epoxy : UL94-V0 rated flame retardant
- Case : Molded plastic, DO-41
- Lead : Axial leads, solderable per MIL-STD-202,
Method 208 guaranteed
- Polarity: Color band denotes cathode end
- Mounting Position : Any
- Weight : Approximated 0.33 gram
EF101PG THRU EF105PG
Package outline DO-41
.107(2.7) .080(2.0)
DIA.
.034(.9) .028(.7)
DIA.
1.0(25.4) MIN.
.205(5.2) .166(4.2)
1.0(25.4) MIN.
Dimensions in inches and (millimeters)
Maximum ratings (AT TA=25o C unless otherwise noted)
PARAMETER Forward rectified current
CONDITIONS Ambient temperature = 55OC
Forward surge current
Reverse current Diode junction capacitance...
