• Part: CSOIC
  • Description: Ceramic Small Outline Integrated Circuit Package
  • Manufacturer: Amkor Technology
  • Size: 392.27 KB
Download CSOIC Datasheet PDF

CSOIC Key Features

  • 28 lead count (Others available if supplied and tooled)
  • 300 mil body size
  • Hermetic solder sealed package
  • High thermal conductive ceramic
  • Gold lead finish
  • "Gullwing" lead form
  • JEDEC and EIAJ package outline standard pliant
  • Wide selection of cavity sizes to meet most die size needs
  • mercial or full Military flows