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Analog Devices Semiconductor Electronic Components Datasheet

LTC3676ELXE-1 Datasheet

Power Management

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LTC3676/LTC3676-1
Power Management Solution
for Application Processors
FEATURES
n Quad I2C Adjustable High Efficiency Step Down
DC/DC Converters: 2.5A, 2.5A, 1.5A, 1.5A
n Three 300mA LDO Regulators (Two Adjustable)
n DDR Power Solution with VTT and VTTR Reference
n Pushbutton ON/OFF Control with System Reset
n Independent Enable Pin-Strap or I2C Sequencing
n Programmable Autonomous Power-Down Control
n Dynamic Voltage Scaling
n Power Good and Reset Functions
n Selectable 2.25MHz or 1.12MHz Switching Frequency
n Always Alive 25mA LDO Regulator
n 12µA Standby Current
n Low Profile 40-Lead 6mm 6mm QFN and 48-Lead
Exposed Pad LQFP
n AEC-Q100 Qualified for Automotive Application
APPLICATIONS
n Supports Freescale i.MX6, ARM Cortex, and Other
Application Processors
n Handheld Instruments and Scanners
n Portable Industrial and Medical Devices
n Automotive Infotainment
n High End Consumer Devices
n Multi-Rail Systems
DESCRIPTION
The LTC®3676 is a complete power management solution
for advanced portable application processor-based sys-
tems. The device contains four synchronous step-down
DC/DC converters for core, memory, I/O, and system
on-chip (SoC) rails and three 300mA LDO regulators for
low noise analog supplies. The LTC3676-1 has a ±1.5A
buck regulator configured to support DDR termination
plus a VTTR reference output. An I2C serial port is used
to control regulator enables, power-down sequencing,
output voltage levels, dynamic voltage scaling, operating
modes and status reporting.
Regulator start-up is sequenced by connecting outputs to
enable pins in the desired order or via the I2C port. System
power-on, power-off and reset functions are controlled by
pushbutton interface, pin inputs, or I2C.
The LTC3676 supports i.MX, PXA and OMAP processors
with eight independent rails at appropriate power levels.
Other features include interface signals such as the VSTB
pin that toggles between programmed run and standby
output voltages on up to four rails simultaneously. The
device is available in a 40-lead 6mm 6mm QFN and
48‑lead exposed pad LQFP packages.
All registered trademarks and trademarks are the property of their respective owners.
TYPICAL APPLICATION
VIN
2.7V TO 5.5V
VRTC
3V
25mA
VDD(HIGH)
2.97V
300mA
VLDO3
1.8V
300mA
3V
300mA
VIN
LDO1
SW3
1µF
LTC3676-1
LDO2
SW2
1µF
1.5µH
1.5µH
LDO3
1µF
1.5µH
SW4
LDO4
1µF
1.5µH
SW1
6
ENABLES VTTR
PWR_ON WAKE
ON
PGOOD
GND I2C
2
3676 TA01a
VARM
1.38V
47µF 2.5A
VSOC
1.38V
47µF 1.5A
VDDR (VDDQ)
1.5V
47µF 2.5A
VTT
1/2 VDDQ
47µF 1.5A
VTTR (1/2 VDDQ)
WAKE
TO µPROCESSOR
5V/DIV
1V/DIV
1V/DIV
Start-Up Sequence
WAKE
VDD(HIGH)
VLDO3
VARM AND VSOC
VDDR
VTT AND VTTR
1ms/DIV
3676 TA01b
Document Feedback
For more information www.analog.com
Rev. G
1


Analog Devices Semiconductor Electronic Components Datasheet

LTC3676ELXE-1 Datasheet

Power Management

No Preview Available !

LTC3676/LTC3676-1
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN, DVDD, SW1, SW2, SW3, SW4................ –0.3V to 6V
SW1, SW2, SW3, SW4
(Transient t < 1µs, Duty Cycle < 5%)................ –2V to 7V
PVIN1, PVIN2, PVIN3, PVIN4, VIN_L2,
VIN_L3, VIN_L4................................... –0.3V to VIN + 0.3V
LDO1, FB_L1, LDO2, FB_L2, LDO3, LDO4, FB_L4,
FB_B1, FB_B2, FB_B3, FB_B4, PGOOD, VSTB, EN_B1,
EN_B2, EN_B3, EN_B4, EN_L2, EN_L3, EN_L4, ON,
WAKE, RSTO, PWR_ON, IRQ, VTTR,
VDDQIN........................................................ –0.3V to 6V
SDA, SCL.......................................–0.3V to DVDD + 0.3V
Operating Junction Temperature Range
(Notes 2, 3)............................................. –40°C to 150°C
Storage Temperature Range.......................–65 to 150°C
PIN CONFIGURATION
LTC3676
TOP VIEW
40 39 38 37 36 35 34 33 32 31
FB_L2 1
30 EN_L2
VIN_L2 2
LDO2 3
29 ON
28 LDO1
LDO3 4
VIN_L3 5
LDO4 6
27 VIN
41
26 FB_L1
GND
25 FB_B2
VIN_L4 7
FB_L4 8
24 FB_B1
23 FB_B4
EN_L4 9
22 FB_B3
EN_L3 10
21 PWR_ON
11 12 13 14 15 16 17 18 19 20
LTC3676
UJ PACKAGE
40-LEAD (6mm × 6mm) PLASTIC QFN
TJMAX = 150°C, θJA = 33°C/W, θJC = 2°C/W
EXPOSED PAD (PIN 41) IS GND, MUST BE SOLDERED TO PCB
TOP VIEW
LTC3676-1
TOP VIEW
40 39 38 37 36 35 34 33 32 31
FB_L2 1
30 EN_L2
VIN_L2 2
LDO2 3
29 ON
28 LDO1
LDO3 4
VIN_L3 5
LDO4 6
27 VIN
41
26 FB_L1
GND
25 FB_B2
VIN_L4 7
VDDQIN 8
24 FB_B1
23 FB_B4
VTTR 9
22 FB_B3
EN_L3 10
21 PWR_ON
11 12 13 14 15 16 17 18 19 20
LTC3676-1
UJ PACKAGE
40-LEAD (6mm × 6mm) PLASTIC QFN
TJMAX = 150°C, θJA = 33°C/W, θJC = 2°C/W
EXPOSED PAD (PIN 41) IS GND, MUST BE SOLDERED TO PCB
TOP VIEW
NC 1
36 NC
FB_L2 2
35 EN_L2
VIN_L2 3
LDO2 4
34 ON
33 LDO1
LDO3 5
32 VIN
VIN_L3 6
49
31 FB_L1
LD04 7
GND
30 FB_B2
VIN_L4 8
FB_L4 9
29 FB_B1
28 FB_B4
EN_L4 10
27 FB_B3
EN_L3 11
26 PWR_ON
NC 12
25 NC
NC 1
36 NC
FB_L2 2
35 EN_L2
VIN_L2 3
LDO2 4
34 ON
33 LDO1
LDO3 5
32 VIN
VIN_L3 6
49
31 FB_L1
LD04 7
GND
30 FB_B2
VIN_L4 8
VDDQIN 9
29 FB_B1
28 FB_B4
VTTR 10
27 FB_B3
EN_L3 11
26 PWR_ON
NC 12
25 NC
2
LXE PACKAGE
48-LEAD (7mm × 7mm) PLASTIC LQFP
TJMAX = 150°C, θJA = 19°C/W, θJC = 3°C/W
EXPOSED PAD (PIN 49) IS GND, MUST BE SOLDERED TO PCB
LXE PACKAGE
48-LEAD (7mm × 7mm) PLASTIC LQFP
TJMAX = 150°C, θJA = 19°C/W, θJC = 3°C/W
EXPOSED PAD (PIN 49) IS GND, MUST BE SOLDERED TO PCB
For more information www.analog.com
Rev. G


Part Number LTC3676ELXE-1
Description Power Management
Maker Analog Devices
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