Analog Devices Semiconductor Electronic Components Datasheet

LTC3676HLXE-1 Datasheet

Power Management

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LTC3676/LTC3676-1

Power Management Solution

for Application Processors

FEATURES

n Quad I2C Adjustable High Efficiency Step Down

DC/DC Converters: 2.5A, 2.5A, 1.5A, 1.5A

n Three 300mA LDO Regulators (Two Adjustable)

n DDR Power Solution with VTT and VTTR Reference

n Pushbutton ON/OFF Control with System Reset

n Independent Enable Pin-Strap or I2C Sequencing

n Programmable Autonomous Power-Down Control

n Dynamic Voltage Scaling

n Power Good and Reset Functions

n Selectable 2.25MHz or 1.12MHz Switching Frequency

n Always Alive 25mA LDO Regulator

n 12µA Standby Current

n Low Profile 40-Lead 6mm  6mm QFN and 48-Lead

Exposed Pad LQFP

n AEC-Q100 Qualified for Automotive Application

APPLICATIONS

n Supports Freescale i.MX6, ARM Cortex, and Other

Application Processors

n Handheld Instruments and Scanners

n Portable Industrial and Medical Devices

n Automotive Infotainment

n High End Consumer Devices

n Multi-Rail Systems

DESCRIPTION

The LTC®3676 is a complete power management solution

for advanced portable application processor-based sys-

tems. The device contains four synchronous step-down

DC/DC converters for core, memory, I/O, and system

on-chip (SoC) rails and three 300mA LDO regulators for

low noise analog supplies. The LTC3676-1 has a ±1.5A

buck regulator configured to support DDR termination

plus a VTTR reference output. An I2C serial port is used

to control regulator enables, power-down sequencing,

output voltage levels, dynamic voltage scaling, operating

modes and status reporting.

Regulator start-up is sequenced by connecting outputs to

enable pins in the desired order or via the I2C port. System

power-on, power-off and reset functions are controlled by

pushbutton interface, pin inputs, or I2C.

The LTC3676 supports i.MX, PXA and OMAP processors

with eight independent rails at appropriate power levels.

Other features include interface signals such as the VSTB

pin that toggles between programmed run and standby

output voltages on up to four rails simultaneously. The

device is available in a 40-lead 6mm  6mm QFN and

48‑lead exposed pad LQFP packages.

All registered trademarks and trademarks are the property of their respective owners.

TYPICAL APPLICATION

VIN

2.7V TO 5.5V

VRTC

25mA

VDD(HIGH)

2.97V

300mA

VLDO3

1.8V

300mA

VIN

LDO1

SW3

1µF

LTC3676-1

LDO2

SW2

1µF

1.5µH

LDO3

1µF

1.5µH

SW4

LDO4

1µF

1.5µH

SW1

ENABLES VTTR

PWR_ON WAKE

PGOOD

GND I2C

3676 TA01a

VARM

1.38V

47µF 2.5A

VSOC

1.38V

47µF 1.5A

VDDR (VDDQ)

1.5V

47µF 2.5A

VTT

1/2 VDDQ

47µF 1.5A

VTTR (1/2 VDDQ)

WAKE

TO µPROCESSOR

5V/DIV

1V/DIV

Start-Up Sequence

WAKE

VDD(HIGH)

VLDO3

VARM AND VSOC

VDDR

VTT AND VTTR

1ms/DIV

3676 TA01b

Document Feedback

For more information www.analog.com

Rev. G

Analog Devices Semiconductor Electronic Components Datasheet

LTC3676HLXE-1 Datasheet

Power Management

No Preview Available !

LTC3676/LTC3676-1

ABSOLUTE MAXIMUM RATINGS (Note 1)

VIN, DVDD, SW1, SW2, SW3, SW4................ –0.3V to 6V

SW1, SW2, SW3, SW4

(Transient t < 1µs, Duty Cycle < 5%)................ –2V to 7V

PVIN1, PVIN2, PVIN3, PVIN4, VIN_L2,

VIN_L3, VIN_L4................................... –0.3V to VIN + 0.3V

LDO1, FB_L1, LDO2, FB_L2, LDO3, LDO4, FB_L4,

FB_B1, FB_B2, FB_B3, FB_B4, PGOOD, VSTB, EN_B1,

EN_B2, EN_B3, EN_B4, EN_L2, EN_L3, EN_L4, ON,

WAKE, RSTO, PWR_ON, IRQ, VTTR,

VDDQIN........................................................ –0.3V to 6V

SDA, SCL.......................................–0.3V to DVDD + 0.3V

Operating Junction Temperature Range

(Notes 2, 3)............................................. –40°C to 150°C

Storage Temperature Range.......................–65 to 150°C

PIN CONFIGURATION

LTC3676

TOP VIEW

40 39 38 37 36 35 34 33 32 31

FB_L2 1

30 EN_L2

VIN_L2 2

LDO2 3

29 ON

28 LDO1

LDO3 4

VIN_L3 5

LDO4 6

27 VIN

26 FB_L1

GND

25 FB_B2

VIN_L4 7

FB_L4 8

24 FB_B1

23 FB_B4

EN_L4 9

22 FB_B3

EN_L3 10

21 PWR_ON

11 12 13 14 15 16 17 18 19 20

LTC3676

UJ PACKAGE

40-LEAD (6mm × 6mm) PLASTIC QFN

TJMAX = 150°C, θJA = 33°C/W, θJC = 2°C/W

EXPOSED PAD (PIN 41) IS GND, MUST BE SOLDERED TO PCB

TOP VIEW

LTC3676-1

TOP VIEW

40 39 38 37 36 35 34 33 32 31

FB_L2 1

30 EN_L2

VIN_L2 2

LDO2 3

29 ON

28 LDO1

LDO3 4

VIN_L3 5

LDO4 6

27 VIN

26 FB_L1

GND

25 FB_B2

VIN_L4 7

VDDQIN 8

24 FB_B1

23 FB_B4

VTTR 9

22 FB_B3

EN_L3 10

21 PWR_ON

11 12 13 14 15 16 17 18 19 20

LTC3676-1

UJ PACKAGE

40-LEAD (6mm × 6mm) PLASTIC QFN

TJMAX = 150°C, θJA = 33°C/W, θJC = 2°C/W

EXPOSED PAD (PIN 41) IS GND, MUST BE SOLDERED TO PCB

TOP VIEW

NC 1

36 NC

FB_L2 2

35 EN_L2

VIN_L2 3

LDO2 4

34 ON

33 LDO1

LDO3 5

32 VIN

VIN_L3 6

31 FB_L1

LD04 7

GND

30 FB_B2

VIN_L4 8

FB_L4 9

29 FB_B1

28 FB_B4

EN_L4 10

27 FB_B3

EN_L3 11

26 PWR_ON

NC 12

25 NC

NC 1

36 NC

FB_L2 2

35 EN_L2

VIN_L2 3

LDO2 4

34 ON

33 LDO1

LDO3 5

32 VIN

VIN_L3 6

31 FB_L1

LD04 7

GND

30 FB_B2

VIN_L4 8

VDDQIN 9

29 FB_B1

28 FB_B4

VTTR 10

27 FB_B3

EN_L3 11

26 PWR_ON

NC 12

25 NC

LXE PACKAGE

48-LEAD (7mm × 7mm) PLASTIC LQFP

TJMAX = 150°C, θJA = 19°C/W, θJC = 3°C/W

EXPOSED PAD (PIN 49) IS GND, MUST BE SOLDERED TO PCB

LXE PACKAGE

48-LEAD (7mm × 7mm) PLASTIC LQFP

TJMAX = 150°C, θJA = 19°C/W, θJC = 3°C/W

EXPOSED PAD (PIN 49) IS GND, MUST BE SOLDERED TO PCB

For more information www.analog.com

Rev. G

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