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LTM8049 Datasheet

Dual SEPIC or Inverting uModule DC/DC Converter

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LTM8049
Dual SEPIC or Inverting
µModule DC/DC Converter
FEATURES
nn Two Complete Switch Mode Power Supplies
nn SEPIC or Inverting Topology
nn Wide Input Voltage Range: 2.6V to 20V
nn 2.5V to 24V or –2.5V to –24V Output Voltage
nn 1A at 5VOUT from 12VIN
nn Selectable Switching Frequency: 200kHz to 2.5MHz
nn Power Good Outputs for Event Based Sequencing
nn User Configurable Undervoltage Lockout
nn (e4) RoHS Compliant Package with Gold Pad Finish
nn Low Profile 15mm × 9mm × 2.42mm Surface Mount
BGA Package
APPLICATIONS
nn Battery Powered Regulator
nn Local Negative Voltage Regulator
nn Low Noise Amplifier Power
DESCRIPTION
The LTM®8049 is a Dual SEPIC/Inverting µModule® (power
module) DC/DC Converter. Each of the two outputs can be
easily configured as a SEPIC or Inverting converter by sim-
ply grounding the appropriate output rail. The LTM8049
includes power devices, inductors, control circuitry and
passive components. All that is needed to complete the
design are input and output caps, and small resistors to
set the output voltages and switching frequency. Other
components may be used to control the soft-start and
undervoltage lockout.
The LTM8049 is packaged in a thermally enhanced, com-
pact (15mm × 9mm) over-molded Ball Grid Array (BGA)
package suitable for automated assembly by standard
surface mount equipment. The LTM8049 is available with
SnPb (BGA) or RoHS compliant terminal finish.
All registered trademarks and trademarks are the property of their respective owners.
TYPICAL APPLICATION
±12VOUT from 2.7VIN to 20VIN
VIN
2.7V TO 20V
4.7µF
×2
80.6k
1MHz
80.6k
1MHz
VIN1
RUN1
RT1
CLKOUT1
SYNC2
RT2
VIN2
RUN2
SYNC1
LTM8049
VOUT1P
FBX1
VOUT1N
130k
VOUT1
12V
22µF
VOUT2P
FBX2
VOUT2N
143k
47µF
VOUT2
–12V
PINS NOT USED: SS1, SS2, PG1, PG2, CLKOUT2, SHARE1, SHARE2
8049 TA01a
Maximum Load Current vs VIN
1.5
1.0
0.5
0
0 5 10 15 20
VIN (V)
8049 TA01
Document Feedback
For more information www.analog.com
Rev B
1


Analog Devices Semiconductor Electronic Components Datasheet

LTM8049 Datasheet

Dual SEPIC or Inverting uModule DC/DC Converter

No Preview Available !

LTM8049
ABSOLUTE MAXIMUM RATINGS
(Note 1)
VINn, RUNn, PGn........................................................20V
SYNCn, FBXn...............................................................5V
SSn...........................................................................2.5V
SHAREn.......................................................................2V
VOUTP (VOUTN = 0V)...................................................25V
VOUTN (VOUTP = 0V).................................................–25V
Maximum Internal Temperature............................. 125°C
Maximum Solder Temperature............................... 260°C
Storage Temperature.............................. –55°C to 125°C
PIN CONFIGURATION
TOP VIEW
BANK 4 A
VOUT1P B
FBX1 C
BANK 6 D
VOUT1N E
F
BANK 7 G
VOUT2N H
FBX2 J
BANK 2
VIN1
RUN1 BANK 1
SS1 GND
PG1
SYNC1
CLKOUT1
RT1
SHARE2
SHARE1
RT2
CLKOUT2
SYNC2
PG2
SS2
BANK 5 K
VOUT2P L
RUN2
BANK 3
VIN2
1234567
BGA PACKAGE
77-LEAD (15mm × 9mm × 2.42mm)
TJMAX = 125°C, θJA = 16.2°C/W, θJB = 3.8°C/W, θJCtop = 8.8°C/W,
θJCbottom = 3.8°C/W, θJCboard = 4.6°C/W, WEIGHT = 0.8g,
θ VALUES DETERMINED PER JEDEC 51-9, 51-12
ORDER INFORMATION
PART MARKING*
PART NUMBER
PAD OR BALL FINISH DEVICE
FINISH CODE
LTM8049EY#PBF
LTM8049IY#PBF
SAC305 (RoHS)
LTM8049Y
e1
LTM8049IY
SnPb (63/37)
LTM8049
e0
• Device temperature grade is indicated by a label on the shipping container.
• Pad or ball finish code is per IPC/JEDEC J-STD-609.
BGA Package and Tray Drawings
PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(SEE NOTE 2)
BGA 3 –40°C to 125°C
• This product is not recommended for second side reflow.
This product is moisture sensitive. For more information, go
to Recommended BGA PCB Assembly and Manufacturing
Procedures.
Rev B
2 For more information www.analog.com


Part Number LTM8049
Description Dual SEPIC or Inverting uModule DC/DC Converter
Maker Analog Devices
Total Page 20 Pages
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