HSMF-C168 - Miniature Bi-Color Surface Mount ChipLEDs
Avago Technologies (now Broadcom)
Download the HSMF-C168 datasheet PDF.
This datasheet also covers the HSMF-C16x variant, as both devices belong to the same miniature bi-color surface mount chipleds family and are provided as variant models within a single manufacturer datasheet.
General Description
This series of bi-color ChipLEDs is designed with the smallest footprint to achieve high density of components on board.
They have the industry standard footprint of 1.6 mm x 0.8 mm and a height of only 0.5 mm.
Key Features
Small size.
0603 industry standard footprint.
Diffused optics.
Operating temperature range of.
40° C to +85° C.
Compatible with reflow soldering.
Available in various color combination.
Available in 8 mm tape on 7" (178 mm) diameter reels.
Full PDF Text Transcription for HSMF-C168 (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
HSMF-C168. For precise diagrams, and layout, please refer to the original PDF.
HSMF-C16x Miniature Bi-Color Surface Mount ChipLEDs Data Sheet Description This series of bi-color ChipLEDs is designed with the smallest footprint to achieve high densit...
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hipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of 1.6 mm x 0.8 mm and a height of only 0.5 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication. They are available in a wide range of color combinations. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel. These parts are compatible with reflow soldering.
More Datasheets from Avago Technologies (now Broadcom)
HSMF-C168 Datasheet
