• Part: S558-3855-00
  • Description: HIGH SPEED LAN MAGNETICS
  • Manufacturer: Bel Fuse
  • Size: 230.72 KB
Download S558-3855-00 Datasheet PDF
Bel Fuse
S558-3855-00
S558-3855-00 is HIGH SPEED LAN MAGNETICS manufactured by Bel Fuse.
- Part of the S558-0139-00 comparator family.
defining a degree of excellence HIGH SPEED LAN MAGNETICS 960025A - For use in 100Base-TX, 10/100Base-TX, ATM 155 or 100 Mbps TP-FDDI applications - patible with multiple PHY transceivers - 350 µH min OCL (inductance) with 8m A DC bias - Low profile, surface mount packaging available - Low cost, transmit or receive channel solution - 2000 Vrms isolation ELECTRICALS AT 25°C .. Part No. S558-0139-00 S558-3855-00 S558-5999-02 S558-5999-19 Insertion Loss (d B) Typ 1MHz-100MHz -1.0 -1.0 -1.0 -1.0 1MHz-30MHz -16 -16 -16 -16 Return Loss (d B) Min 30MHz-60MHz 16-20log((f/30MHz) 16-20log((f/30MHz) 16-20log((f/30MHz) 16-20log((f/30MHz) 60MHz-80MHz -10 -10 -10 -10 Schematic A B A B SCHEMATICS MECHANICAL Specifications subject to change without notice. Bel Fuse Inc. 198 Van Vorst Street, Jersey City, NJ 07302 - Tel: 201-432-0463 - Fax: 201-432-9542 - E-Mail: Bel Fuse@belfuse. Website: http://.belfuse. defining a degree of excellence HIGH SPEED LAN MAGNETICS 960025A APPLICATION CIRCUIT .. APPLICATION NOTES - These Bel part types have been designed for use in 100 Mbps TP-FDDI, 100Base-TX, 10/100Base-TX and ATM 155 Mbps applications over Category 5 UTP or STP cable. - Each Bel part type is designed with high voltage isolation transformers and mon mode chokes and can be used on both the transmit and receive channels. The designs have been created to provide 350µH OCL with 8m A DC bias applied. Consult the Bel short form catalog and applicable application circuit for the specific configuration of each individual part type. - Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped on tape and reel for high speed placement. Construction processes have been implemented for thermal patibility with high temperature IR reflow assembly processing. Post dipping of leads assist with PC board solderability. Each part is optically inspected to meet rigid coplanarity requirements. Corporate Office Bel Fuse Inc. 198 Van...