HC1000 material equivalent, gel-like modulus gap filling material.
* Thermal conductivity: 1.0 W/m-K
* Highly conformable, low hardness
* “Gel-like” modulus
* Fiberglass reinforced for puncture,
shear and tear resistance
.
Include:
* Computer and peripherals
* Telecommunications
* Heat interfaces to frames, chassis, or other heat.
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