1.0SMB SERIES
Transient Voltage Suppressors (TVS) Data Sheet
Features
■ For surface mounted applications in order to optimize board space
■ Low profile package
■ Built-in strain relief
■ Glass passivated junction
■ Low inductance
■ Excellent clamping capability
■ 1000W peak pulse power capability at 10/1000μs waveform,
repetition rate (duty cycle): 0.01%
■ Fast response time
■ Typical IR less than 1μA above 12V
■ High Temperature soldering: 260℃/10 seconds at terminals
■ Plastic package has underwriters laboratory flammability 94V-0
■ Meets MSL level 1, per J-STD-020
Mechanical Data
■ Case: JEDEC DO-214AA. Molded plastic over glass passivated junction
■ Terminal: Solder plated, solderable per MIL-STD-750, Method 2026
■ Polarity: Color band denotes cathode except bi-directional models
■ Standard Packaging: 12mm tape (EIA STD RS-481)
■ Weight: 0.10g
Applications
■ I/O interface
■ AC/DC power supply
■ Low frequency signal transmission line (RS232, RS485, etc.)
Maximum Ratings and Characteristics
Ratings at 25℃ ambient temperature unless otherwise specified.
Rating
Symbol
Value
Units
Peak pulse power dissipation at 10/1000μs waveform
(Note1, Note2, Fig.1)
PPPM
Minimum 1000 Watts
Peak pulse current of at 10/1000μs waveform (Note 1, Fig.3)
IPPM
See Table
Amps
Steady state power dissipation at TA=50℃ (Fig.5)
Peak forward surge current, 8.3ms single half sine-wave
superimposed on rated load, (JEDEC Method) (Note3, Fig.6)
PM(AV)
IFSM
5.0 Watts
100 Amps
Operating junction and Storage Temperature Range.
TJ,TSTG
-65 to +150
℃
Typical thermal resistance junction to lead
RθJL
20 ℃/W
Typical thermal resistance junction to ambient
RθJA
100 ℃/W
Notes: 1. Non-repetitive current pulse, per Fig.3 and derated above TA=25℃ per Fig.2.
2. Mounted on 5.0mm×5.0mm (0.03mm thick) copper pads to each terminal.
3. 8.3ms single half sine-wave, or equivalent square wave, duty cycle=4 pulses per minutes maximum.
Revision：16-Jun-15
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