1.0SMB33CA
Key Features
- For surface mounted applications in order to optimize board space
- Low profile package
- Built-in strain relief
- Glass passivated junction
- Low inductance
- Excellent clamping capability
- 1000W peak pulse power capability at 10/1000μs waveform
- Fast response time
- Typical IR less than 1μA above 12V
- High Temperature soldering: 260℃/10 seconds at terminals
Applications
- I/O interface
