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HCPL-M453 - High-Speed Optocouplers

Download the HCPL-M453 datasheet PDF. This datasheet also covers the HCPL-M452 variant, as both devices belong to the same high-speed optocouplers family and are provided as variant models within a single manufacturer datasheet.

Description

The Broadcom® HCPL-M452/HCPL-M453 small outline high CMR, high-speed, diode-transistor optocouplers are single-channel devices in a five-lead miniature footprint.

The SO-5 JEDEC registered (MO-155) package outline does not require through holes in a PCB.

Features

  • Surface mountable.
  • Very small, low-profile JEDEC registered package outline.
  • Compatible with infrared vapor phase reflow and wave soldering processes.
  • Very high common mode transient immunity: 1,5000 V/µs at VCM = 1500V guaranteed (HCPL-M453).
  • High speed: 1 Mb/s.
  • TTL compatible.
  • Open collector output.
  • Worldwide safety approval:.
  • UL1577 recognized, 3750Vrms/1min.
  • CSA approved.
  • Lead-free option.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (HCPL-M452-Broadcom.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer
HCPL-M453 High Speed Optocouplers Agilent
HCPL-M452 High Speed Optocouplers Agilent
HCPL-M454 Ultra High CMR / Small Outline / 5 Lead / High Speed Optocoupler Hewlett-Packard
HCPL-M600 Logic Gate Optocouplers Avago
HCPL-M600 Logic Gate Optocouplers Agilent

Other Datasheets by Broadcom

Part Number Description
HCPL-M452 High-Speed Optocouplers
HCPL-0500 High-Speed Optocouplers
HCPL-0501 High-Speed Optocouplers
HCPL-0600 High Speed TTL Compatible Optocouplers
HCPL-0601 High Speed TTL Compatible Optocouplers

Full PDF Text Transcription

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HCPL-M452/HCPL-M453 Small Outline, 5-Lead, High-Speed Optocouplers Data Sheet Description The Broadcom® HCPL-M452/HCPL-M453 small outline high CMR, high-speed, diode-transistor optocouplers are single-channel devices in a five-lead miniature footprint. The SO-5 JEDEC registered (MO-155) package outline does not require through holes in a PCB. This package occupies approximately one-fourth the footprint area of the standard dual-inline package. The lead profile is designed to be compatible with standard surface-mount processes. These diode-transistor optocouplers use an insulating layer between the LED and an integrated photon detector to provide electrical insulation between input and output.
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