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HCPL-M453 - High-Speed Optocouplers

Download the HCPL-M453 datasheet PDF. This datasheet also covers the HCPL-M452 variant, as both devices belong to the same high-speed optocouplers family and are provided as variant models within a single manufacturer datasheet.

General Description

The Broadcom® HCPL-M452/HCPL-M453 small outline high CMR, high-speed, diode-transistor optocouplers are single-channel devices in a five-lead miniature footprint.

The SO-5 JEDEC registered (MO-155) package outline does not require through holes in a PCB.

Key Features

  • Surface mountable.
  • Very small, low-profile JEDEC registered package outline.
  • Compatible with infrared vapor phase reflow and wave soldering processes.
  • Very high common mode transient immunity: 1,5000 V/µs at VCM = 1500V guaranteed (HCPL-M453).
  • High speed: 1 Mb/s.
  • TTL compatible.
  • Open collector output.
  • Worldwide safety approval:.
  • UL1577 recognized, 3750Vrms/1min.
  • CSA approved.
  • Lead-free option.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (HCPL-M452-Broadcom.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
HCPL-M452/HCPL-M453 Small Outline, 5-Lead, High-Speed Optocouplers Data Sheet Description The Broadcom® HCPL-M452/HCPL-M453 small outline high CMR, high-speed, diode-transistor optocouplers are single-channel devices in a five-lead miniature footprint. The SO-5 JEDEC registered (MO-155) package outline does not require through holes in a PCB. This package occupies approximately one-fourth the footprint area of the standard dual-inline package. The lead profile is designed to be compatible with standard surface-mount processes. These diode-transistor optocouplers use an insulating layer between the LED and an integrated photon detector to provide electrical insulation between input and output.