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MMSZ5221B-MMSZ5260B
Surface mount zener diode
Features • Planar die construction. • 500mW power dissipation. • General purpose, medium current. • Ideally suited for automated assembly processes. • RoHS compliant package Applications • Zener diode. • Ultra-small surface mount package. Packing & Order Information 3,000/Reel
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MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
MAXIMUM RATING @ Ta=25°C unless otherwise specified
Symbol
Parameter
Value
VF Forward Voltage @ IF=10mA
0.9
PD RθJA
Power Dissipation Thermal resistance,junction to ambient air
500 350
TJ Junction Temperature
150
Tstg Storage Temperature Range
-65 to +150
Notes:
1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2. 2. Tested with pulses, Tp ≤1.0ms.
MMSZ5246B Datasheet
