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BF241 Datasheet Preview

BF241 Datasheet

NPN SILICON PLANAR EPITAXIAL RF TRANSISTORS

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Continental Device India Limited
An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company
NPN SILICON PLANAR EPITAXIAL RF TRANSISTORS
BF240
BF241
TO-92
Plastic Package
EBC
A.M.Mixer, IF Amplifiers in AM/ FM Receiver Applications
ABSOLUTE MAXIMUM RATINGS(Ta=25ºC unless otherwise specified)
DESCRIPTION
Collector Emitter Voltage
Collector Base Voltage
Emitter Base Voltage
Collector Current Continuous
Power Dissipation@ Ta=25ºC
Dereate Above 25 deg C
Power Dissipation@ Tc=25ºC
Dereate Above 25ºC
Operating and Storage Junction
Temperature Range
SYMBOL
VCEO
VCBO
VEBO
IC
PD
PD
Tj, Tstg
Value
40
40
4
25
350
2.8
1
8.0
-55 to +150
ELECTRICAL CHARACTERISTICS (Ta=25ºC Unless Otherwise Specified)
DESCRIPTION
Collector Emitter Voltage
Collector Base Voltage
EmitterBase Voltage
Collector-Cut off Current
Base Emitter On Voltage
DC Current Gain
Transition Frequency
SYMBOL
BVCEO *
BVCBO
BVEBO
ICBO
VBE(on)
TEST CONDITION
IC=1mA,IB=0
IC=100uA.IE=0
IE=10uA, IC=0
VCB=20V,IE=0
IC=1mA,VCE=10V
BF240 hFE IC=1mA,VCE=10V
BF241
BF240 fT IC=1mA, VCE=10V
f=100MHz
BF241
MIN
40
40
4
0.65
65
35
Feedback Capacitance
Cre VCB=10V, IE=0 ,
f=1MHz
*Pulse Test: Pulse Width < 300us, Duty Cycle < 2%.
TYP
0.7
600
470
0.28
UNITS
V
V
V
mA
mW
mW/ ºC
W
mW/ ºC
ºC
MAX
0.1
0.74
220
125
0.34
UNITS
V
V
V
uA
V
MHz
MHz
pF
Continental Device India Limited
Data Sheet
Page 1 of 3
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CDIL

BF241 Datasheet Preview

BF241 Datasheet

NPN SILICON PLANAR EPITAXIAL RF TRANSISTORS

No Preview Available !

BF240
BF241
TO-92
Plastic Package
TO-92 Plastic Package
B
1
2
3
D AA
G
FF
321
PIN CONFIGURATION
1. COLLECTOR
2. BASE
3. EMITTER
D
SEC AA
321
DIM MIN. MAX.
A 4.32 5.33
B 4.45 5.20
C 3.18 4.19
D 0.41 0.55
E 0.35 0.50
F 5 DEG
G 1.14 1.40
H 1.14 1.53
K 12.70
L 1.982 2.082
All diminsions in mm.
TO-92 Transistors on Tape and Ammo Pack
Mechanical Data
T
hh
A
H1
Ho
L
H3 H2
P
A1
(p)
h1 h1
Ammo Pack Style
Adhesive Tape on Top Side
C1 Flat side
C2 W2 Label
Wo W1
W
FEED
Carrier
Strip
186
(7.3")
t1
t
F1
F
P2
Po
F2
All dimensions in mm
Do
(1.74")3
332 (13")
Flat Side of Transistor and
Adhesive Tape Visible
2000 pcs./Ammo Pack
ITEM
SYMBOL
BODY WIDTH
BODY HEIGHT
BODY THICKNESS
PITCH OF COMPONENT
FEED HOLE PITCH
FEED HOLE CENTRE TO
COMPONENT CENTRE
DISTANCE BETWEEN OUTER
LEADS
COMPONENT ALIGNMENT SIDE VIEW
COMPONENT ALIGNMENT FRONT VIEW
TAPE WIDTH
HOLD-DOWN TAPE WIDTH
HOLE POSITION
A1
A
T
P
Po
P2
F
h
h1
W
Wo
W1
HOLD-DOWN TAPE POSITION
LEAD WIRE CLINCH HEIGHT
COMPONENT HEIGHT
LENGTH OF SNIPPED LEADS
FEED HOLE DIAMETER
TOTAL TAPE THICKNESS
LEAD - TO - LEAD DISTANCE
STAND OFF
CLINCH HEIGHT
LEAD PARALLELISM
PULL - OUT FORCE
W2
Ho
H1
L
Do
t
F1, F2
H2
H3
| C1 - C2 |
(P)
SPECIFICATION
MIN. NOM. MAX.
4.0 4.8
4.8 5.2
3.9 4.2
12.7
12.7
TOL .
± 1.0
± 0.3
6.35 ± 0.4
5.08
0 1.0
+ 0.6
- 0.2
0 1.3
18 ± 0.5
6 ± 0.2
9 + 0.7
- 0.5
0.5 ± 0.2
16 ± 0.5
23.25
11.0
4 ± 0.2
1.2
2.54
0.45 1.45
+ 0.4
- 0.1
3.0
0.22
6N
REMARKS
CUMULATIVE PITCH ERROR 1.0 mm/20 PITCH
TO BE MEASURED AT BOTTOM OF CLINCH
AT TOP OF BODY
AT TOP OF BODY
t1 0.3-0.6
NOTES
1. Maximum alignment deviation between leads will not to be greater than 0.2mm.
2. Maximum non-cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
3. Holddown tape will not exceed beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
4. There will be no more than three (3) consecutive missing components in a tape.
5. A tape trailer, having at least three feed holes are provided after the last component in a tape.
6. Splices should not interfere with the sprocket feed holes.
Packing Detail
PACKAGE
STANDARD PACK
Details
Net Weight/Qty
TO-92 Bulk
TO-92 T&A
1K/polybag
2K/ammo box
200 gm/1K pcs
645 gm/2K pcs
INNER CARTON BOX
Size
Qty
3" x 7.5" x 7.5"
12.5" x 8" x 1.8"
5K
2K
OUTER CARTNO BOX
Size
Qty Gr Wt
17" x 15" x 13.5"
17" x 15" x 13.5"
80K
32K
23 kgs
12.5 kgs
Continental Device India Limited
Data Sheet
Page 2 of 3


Part Number BF241
Description NPN SILICON PLANAR EPITAXIAL RF TRANSISTORS
Maker CDIL
Total Page 3 Pages
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