SL32A Datasheet | Chip Integration Technology

Features - Low profile surface mounted application in order to optimize board space. - Low power loss, high efficiency. - High current capability, low forward voltage drop. - Ultra high-speed switching. - Silicon epitaxial planar chip, metal silicon junction. - Suffix "G" indicates Halogen-free part, ex.SL32AG. - Lead-free parts meet environmental standards of MIL-STD-19500 /228 - Mechanical data - Epoxy:UL94-V0 rated flame retardant - Case : Molded plastic, DO-214AC / SMA - Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 - Polarity : Indicated by cathode band - Weight : 0.002 ounce, 0.055 gram - Outline SMA(DO-214AC) 0.067 (1.70) 0.047 (1.20) Marking code 0.114 (2.90) 0.083 (2.10) 0.098 (2.50) 0.067 (1.70) 0.181 (4.60) 0.157 (4.00) 0.012 (0.30) TYP. 0.061 (1.55) 0.030 (0.75) 0.224 (5.70) 0.185 (4.70) 0.008 (0.20) 0.004 (0.10) Dimensions in inches and (millimeters) - Maximum ratings and electrical characteristics Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Parameter Forward rectified current Forward surge current Reverse current Diode junction capacitance Thermal resistance Storage temperature Conditions 8.3ms single half sine-wave superimposed on rate load (JEDEC method) VR = VRRM TA = 25OC VR = VRRM TA = 100OC f=1MHz and applied 4V DC reverse voltage Junction to ambient Symbol IO IFSM CJ RθJA TSTG MIN....