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California Micro Devices

CM1206 Datasheet Preview

CM1206 Datasheet

ESD Protection Arrays Chip

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CM1206www.DataSheet4U.com
ESD Protection Arrays, Chip Scale Package
Features
• Functionally and pin compatible with CMD’s
PACDN2404C/08C/16C family of devices
• OptiGuardcoated for improved reliability at
assembly
• 4, 8, or 16 transient voltage suppressors in a single
package
• In-system Electrostatic Discharge (ESD) protection
to +18kV contact discharge per IEC 61000-4-2
international standard
• Supports AC signal applications
• Compact Chip Scale Package (0.65mm pitch) for-
mat saves board space and eases layout in space
critical applications compared to discrete solutions
and traditional wire bonded packages
• Lead-free versions available
Applications
• ESD protection for sensitive electronic equipment
• I/O port, keypad and button circuitry protection for
portable devices
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Cameras and Camcorders
• Notebooks
• Desktop PCs
Product Description
The CM1206 family of transient voltage suppressor
arrays provides a very high level of protection for sensi-
tive electronic components that may be subjected to
ESD. The back-to-back Zener connections provide
ESD protection in cases where nodes with AC signals
are present.
These devices are designed and characterized to
safely dissipate ESD strikes at levels well beyond the
maximum requirements set forth in the IEC 61000-4-2
international standard. All I/Os are rated at +18kV
using the IEC 61000-4-2 contact discharge method.
Using the MIL-STD-883D (Method 3015) specification
for Human Body Model (HBM) ESD, all pins are pro-
tected for contact discharges to greater than +30kV.
The Chip Scale Package format of these devices
enable extremely small footprints that are necessary in
portable electronics such as cellular phones, PDAs,
internet appliances and PCs. The large solder bumps
allow for standard attachment to laminate boards with-
out the use of underfill.
The CM1206 incorporates OptiGuardcoating which
results in improved reliability at assembly. The CM1206
is also available with optional lead-free finishing.
Electrical Schematic
B1 B2 B3
B1 B2 B3 B4 B5
D1 D2 D3 D4 D5
A1 A2 A3
CM1206-04CS/CP
A1 A2 A3 A4 A5
CM1206-08CS/CP
C1 C2 C3 C4 C5
B1 B2 B3 B4 B5
A1 A2 A3 A4 A5
CM1206-16CS/CP
© 2004 California Micro Devices Corp. All rights reserved.
06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
1




California Micro Devices

CM1206 Datasheet Preview

CM1206 Datasheet

ESD Protection Arrays Chip

No Preview Available !

CM1206www.DataSheet4U.com
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
A
B
123
L06
Orientation
Marking
(see note 2)
A
B
TOP VIEW
(Bumps Down View)
12345
120608
Orientation
Marking
(see note 2)
A
TOP VIEW
(Bumps Down View)
12345
BOTTOM VIEW
(Bumps Up View)
CM1206-04
CSP Package
B1 B2 B3
A1 A2 A3
BOTTOM VIEW
(Bumps Up View)
CM1206-08
CSP Package
B1 B2 B3 B4 B5
A1 A2 A3 A4 A5
BOTTOM VIEW
(Bumps Up View)
D1 D2 D3 D4 D5
B CM1206
C 16
C1 C2 C3 C4 C5
B1 B2 B3 B4 B5
D A1 A2 A3 A4
CM1206-16
Notes:
CSP Package
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
A5
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish2
Bumps
Package
Ordering Part
Number1
Part Marking
Ordering Part
Number1
Part Marking
6
CSP
CM1206-04CS
L06
CM1206-04CP
L06
10
CSP
CM1206-08CS
120608
CM1206-08CP
120608
20
CSP
CM1206-16CS
CM120616
CM1206-16CP
CM120616
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark
© 2004 California Micro Devices Corp. All rights reserved.
2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 06/28/04


Part Number CM1206
Description ESD Protection Arrays Chip
Maker California Micro Devices
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CM1206 Datasheet PDF






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