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CP593. For precise diagrams, and layout, please refer to the original PDF.
PROCESS Small Signal Transistor CP593 PNP - Amp/Switch Transistor Chip www.DataSheet4U.com PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bo...
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ETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER EPITAXIAL PLANAR 19 x 19 MILS 9.0 MILS 3.5 x 4.3 MILS 3.5 x 4.5 MILS Al - 30,000Å Au - 18,000Å 30,475 PRINCIPAL DEVICE TYPES 2N4403 2N5366 R2 (22-March 2010) w w w. c e n t r a l s e m i . c o m PROCESS CP593 Typical Electrical Characteristics R2 (22-March 2010) w w w. c e n t r a l s e m i .
CP593 Datasheet
