Download CPS041 Datasheet PDF
CPS041 page 2
Page 2

CPS041 Description

PROCESS CPS041 Silicon Controlled Rectifier Sensitive Gate SCR Chip PROCESS DETAILS Process Die Size Die Thickness Cathode Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization .. (631) 435-1824 .centralsemi. R1 (19 -May 2005) PROCESS CPS041 Typical.