CZRV3-55C33 Datasheet | Comchip Technology

Features -Planar die construction. -200m W power dissipation. -Ideally suited for automated assembly process. -Ultra small surface mount package. Mechanical data -Case: SOT-323, Molded plastic -Terminals: Solderable per MIL-STD- 202G,method 208 -Polarity: See diagram below -Mounting position: Any Marking: see table on page2 SOT-323 0.087(2.20) 0.070(1.80) 0.054(1.35) 0.045(1.15) 0.056(1.40) 0.047(1.20) 0.006(0.15) 0.002(0.05) 0.044(1.10) 0.035(0.90) 0.087(2.20) 0.078(2.00) 0.016(0.40) 0.008(0.20) 0.004(0.10)max. 0.004(0.10)min. Single Dimensions in inches and (millimeter) Maximum Ratings (TA=25°C, unless otherwise specified) Parameter Forward voltage drop at IF=10m A (Note 2) Power dissipation (Note 1) Symbol VF PD Thermal resistance, junction to ambient air Operating junction and storage temperature range RθJA TJ, TSTG Note: 1. Valid provided that device terminals are kept at ambient temperature . 2. Tested with pulses, 300μS pulse width, 2% duty cycle. Value 0.9 200 625 -65 to +150 Unit V m W o C/W OC QW-BZ015 chip Technology CO., LTD. REV:A Page 1 SMD Zener Diodes Electrical Characteristics(Ta = 25°C) Part No. CZRV3-55C2V4 Nominal Zener Voltage VZ @ IZT Nom. Min. Max. 2.4 2.20...