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Low VF Chip Schottky Barrier Rectifier
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to
optimize board space.
• Low power loss, high efficiency. • High current capability, very low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Very tiny plastic SMD package. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction.
SL13N Datasheet
