CYStech Electronics Corp.
Spec. No. : C893E3
Issued Date : 2016.06.01
Revised Date :
Page No. : 2/8
Absolute Maximum Ratings (TC=25°C, unless otherwise noted)
Continuous Drain Current @VGS=10V, TC=25°C
Continuous Drain Current @VGS=10V, TC=100°C
Continuous Drain Current @TA=25°C, VGS=10V (Note 2)
Continuous Drain Current @TA=70°C, VGS=10V (Note 2)
Pulsed Drain Current
Avalanche Energy @ L=0.5mH, ID=24A, VDD=50V (Note 4)
Repetitive Avalanche Energy@ L=0.05mH
Total Power Dissipation (TC=25℃)
Total Power Dissipation (TC=100℃)
Total Power Dissipation (TA=25℃)
Total Power Dissipation (TA=70℃)
Operating Junction and Storage Temperature
Thermal Resistance, Junction-to-case, max
Thermal Resistance, Junction-to-ambient, max (Note 2)
Note : 1.The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful
in setting the upper dissipation limit for cases where additional heatsinking is used.
2. The value of RθJA is measured with the device mounted on 1 in²FR-4 board with 2 oz. copper, in a still air environment
with TA=25°C. The power dissipation PDSM is based on RθJA and the maximum allowed junction
temperature of 150°C. The value in any given application depends on the user’s specific board design, and the
maximum temperature of 175°C may be used if the PCB allows it.
3. Pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and low duty
cycles to keep initial TJ=25°C.
4. 100% tested by conditions of L=0.1mH, IAS=15A, VGS=10V, VDD=50V
CYStek Product Specification