S1MSP1M Key Features
- Glass Passivated Die Construction
- Ideally Suited for Automated Assembly
- Low Profile Design, Package Height Less than 1.0mm
- Low Reverse Leakage Current
- Exceptional Thermal Transfer Based on Exposed Heat Sink on
- Lead-Free Finish; RoHS pliant (Notes 1 & 2)
- Halogen and Antimony Free. “Green” Device (Note 3)
- For automotive