DPS128C32BV3
Description
The DPS128C32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate. It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.300 inches.
Key Features
- Organizations Available: 128K x 32, 256K x 16, or 512K x 8
- Fully Static Operation
- No clock or refresh required
- Single +5V Power Supply, ±10% Tolerance
- TTL compatible
- mon Data Inputs and Outputs
- Low Data Retention Voltage: 2.0V min
- 66-Pin PGA ‘’VERSA-STACK’’ Package
