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DPS128C32BV3 Datasheet 512kx8 High Speed CMOS SRAM

Manufacturer: Dense-Pac Microsystems

Download the DPS128C32BV3 datasheet PDF. This datasheet also includes the DPS128C32BV3_Dense variant, as both parts are published together in a single manufacturer document.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (DPS128C32BV3_Dense-PacMicrosystems.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number DPS128C32BV3
Manufacturer Dense-Pac Microsystems
File Size 512.94 KB
Description 512kx8 High Speed CMOS SRAM
Datasheet download datasheet DPS128C32BV3 Datasheet

General Description

: The DPS128C32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate.

It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.300 inches.

The DPS128C32BV3 contains four individual 128K x 8 SRAMs, packaged in their own hermetically sealed SLCCs making the module suitable for commercial, industrial and military applications.

Overview

4 Megabit High Speed CMOS SRAM DPS128C32BV3.

Key Features

  • Organizations Available: 128K x 32, 256K x 16, or 512K x 8.
  • Access Times: 20, 25, 30, 35, 45ns.
  • Fully Static Operation - No clock or refresh required.
  • Single +5V Power Supply, ±10% Tolerance.
  • TTL Compatible.
  • Common Data Inputs and Outputs.
  • Low Data Retention Voltage: 2.0V min.
  • 66-Pin PGA ‘’VERSA-STACK’’ Package.