Datasheet Details
| Part number | DPS128C32BV3 |
|---|---|
| Manufacturer | Dense-Pac Microsystems |
| File Size | 512.94 KB |
| Description | 512kx8 High Speed CMOS SRAM |
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Download the DPS128C32BV3 datasheet PDF. This datasheet also includes the DPS128C32BV3_Dense variant, as both parts are published together in a single manufacturer document.
| Part number | DPS128C32BV3 |
|---|---|
| Manufacturer | Dense-Pac Microsystems |
| File Size | 512.94 KB |
| Description | 512kx8 High Speed CMOS SRAM |
| Datasheet |
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: The DPS128C32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate.
It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.300 inches.
The DPS128C32BV3 contains four individual 128K x 8 SRAMs, packaged in their own hermetically sealed SLCCs making the module suitable for commercial, industrial and military applications.
4 Megabit High Speed CMOS SRAM DPS128C32BV3.
| Part Number | Description |
|---|---|
| DPS128M8 | 128kx8 High Speed CMOS SRAM |
| DPS128M8xxx | 128kx8 High Speed CMOS SRAM |
| DPS128X32BV3 | 128kx32 High Speed CMOS SRAM |
| DPS128X32CV3 | 128kx32 High Speed CMOS SRAM |